AD5764RCSUZ Analog Devices Inc, AD5764RCSUZ Datasheet - Page 10

IC DAC QUAD 16BIT VOUT 32-TQFP

AD5764RCSUZ

Manufacturer Part Number
AD5764RCSUZ
Description
IC DAC QUAD 16BIT VOUT 32-TQFP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD5764RCSUZ

Data Interface
Serial
Design Resources
High Accuracy, Bipolar Voltage Output Digital-to-Analog Conversion Using AD5764 (CN0006)
Settling Time
8µs
Number Of Bits
16
Number Of Converters
4
Voltage Supply Source
Dual ±
Power Dissipation (max)
275mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-TQFP, 32-VQFP
Resolution (bits)
16bit
Sampling Rate
1.26MSPS
Input Channel Type
Serial
Supply Voltage Range - Digital
2.7V To 5.25V
Supply Current
3.55mA
Digital Ic Case Style
QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
AD5764RCSUZ
Manufacturer:
Analog Devices Inc
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10 000
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AD5764RCSUZ-REEL7
Manufacturer:
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AD5764R
ABSOLUTE MAXIMUM RATINGS
T
100 mA do not cause SCR latch-up.
Table 4.
Parameter
AV
AV
DV
Digital Inputs to DGND
Digital Outputs to DGND
REFAB, REFCD to AGND, PGND
REFOUT to AGND
TEMP
VOUTx to AGND
AGND to DGND
Operating Temperature Range
Storage Temperature Range
Junction Temperature (T
Lead Temperature (Soldering)
A
Industrial
DD
SS
CC
= 25°C, unless otherwise noted. Transient currents of up to
to AGND, DGND
to AGND, DGND
to DGND
J
max)
+0.3 V to −17 V
−0.3 V to +0.3 V
−40°C to +85°C
JEDEC industry standard
Rating
−0.3 V to +17 V
−0.3 V to +7 V
−0.3 V to (DV
whichever is less
−0.3 V to DV
−0.3 V to AV
AV
AV
AV
−65°C to +150°C
150°C
J-STD-020
SS
SS
SS
to AV
to AV
to AV
DD
DD
DD
DD
CC
CC
+ 0.3 V
+ 0.3 V
+ 0.3 V) or +7 V,
Rev. B | Page 10 of 32
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
32-Lead TQFP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
65
JA
θ
12
JC
Unit
°C/W

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