DS90LV001TMX/HAPB National Semiconductor, DS90LV001TMX/HAPB Datasheet - Page 6

• Manufacturer Part Number: DS90LV001TMX/HAPB
• Manufacturer: National Semiconductor

Specifications of DS90LV001TMX/HAPB

• Number Of Elements: 1
• Number Of Receivers: 1
• Number Of Drivers: 1
• Operating Supply Voltage (typ): 3.3V
• Differential Input High Threshold Voltage: 100mV
• Diff. Input Low Threshold Volt: -100mV
• Differential Output Voltage: 450mV
• Transmission Data Rate: 800Mbps
• Propagation Delay Time: 2ns
• Power Dissipation: 726mW
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Lead Free Status / Rohs Status: Not Compliant

www.national.com
DS90LV001 Pin Descriptions (SOIC and LLP)
Typical Applications
Backplane Stub-Hider Application
Pin Name
OUT -
OUT+
GND
DAP
IN −
V
IN+
NC
EN
CC
Pin #
NA
1
2
3
4
5
6
7
8
Input/Output
NA
O
O
P
P
I
I
I
Ground
Inverting receiver LVDS input pin
Non-inverting receiver LVDS input pin
No Connect
Power Supply, 3.3V ± 0.3V.
Non-inverting driver LVDS output pin
Inverting driver LVDS output pin
Enable pin. When EN is LOW, the driver is disabled and the LVDS
outputs are in TRI-STATE. When EN is HIGH, the driver is enabled.
LVCMOS/LVTTL levels.
Die Attach Pad or DAP (LLP Package only). The DAP is NOT connected
to the device GND nor any other pin. It is still recommended to connect
the DAP to a GND plane of a PCB for enhenced heat dissipation.
6
Description
10133811