MT48LC4M16A2TG-8E:G Micron Technology Inc, MT48LC4M16A2TG-8E:G Datasheet - Page 44
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MT48LC4M16A2TG-8E:G
Manufacturer Part Number
MT48LC4M16A2TG-8E:G
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC4M16A2TG-8EG.pdf
(72 pages)
Specifications of MT48LC4M16A2TG-8E:G
Organization
4Mx16
Density
64Mb
Address Bus
14b
Access Time (max)
6ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
120mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
Electrical Specifications
Table 11:
Temperature and Thermal Impedance
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. N 12/08 EN
Parameter
Voltage on V
Voltage on inputs, NC or I/O pins relative to V
Operating temperature
T
T
T
Storage temperature (plastic)
Power dissipation
A
A
A
(commercial)
(industrial)
(automotive)
DD
Absolute Maximum Ratings
, V
DD
Q supply relative to V
Stresses greater than those listed in Table 11 may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may
affect reliability.
It is imperative that the SDRAM device’s temperature specifications, shown in Figure 12
on page 45, be maintained to ensure the junction temperature is in the proper operating
range to meet data sheet specifications. An important step in maintaining the proper
junction temperature is using the device’s thermal impedances correctly. The thermal
impedances are listed in Table 13 on page 45 for the applicable die revision and pack-
ages being made available. These thermal impedance values vary according to the
density, package, and particular design used for each device.
Incorrectly using thermal impedances can produce significant errors. Read Micron tech-
nical note, TN-00-08, “Thermal Applications,” prior to using the thermal impedances
listed in Table 13. To ensure the compatibility of current and future designs, contact
Micron Applications Engineering to confirm thermal impedance values.
The SDRAM device’s safe junction temperature range can be maintained when the TC
specification is not exceeded. In applications where the device's ambient temperature is
too high, use of forced air and/or heat sinks may be required to satisfy the case tempera-
ture specifications.
SS
SS
44
Micron Technology, Inc., reserves the right to change products or specifications without notice.
64Mb: x4, x8, x16 SDRAM
Min
–1V
–1V
–40
–40
–55
Electrical Specifications
0
–
©2000 Micron Technology, Inc. All rights reserved.
Max
+105
+150
+4.6
+4.6
+85
70
1
Units
°C
°C
W
V
V