MT47H16M16FG-3:B Micron Technology Inc, MT47H16M16FG-3:B Datasheet - Page 18

• Manufacturer Part Number: MT47H16M16FG-3:B
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H16M16FG-3:B

• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 215mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

Figure 9: 60-Ball, FBGA Package (8mm x 12mm) – x4, x8
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow.
Seating plane
60X Ø0.45
0.12 C
0.8 TYP
Note:
C
1. All dimensions are in millimeters.
0.8 TYP
8.0 ±0.15
6.4
C L
C L
18
0.8 ±0.1
8.0
Ball A1 ID
12.0 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging