TFBS5700-TR3 Vishay, TFBS5700-TR3 Datasheet - Page 9
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TFBS5700-TR3
Manufacturer Part Number
TFBS5700-TR3
Description
TXRX IRDA 1.152MBIT SIDE 6-SMD
Manufacturer
Vishay
Type
TX/RXr
Datasheet
1.TFBS5700-TR3.pdf
(14 pages)
Specifications of TFBS5700-TR3
Data Rate
1.125Mbps
Peak Wavelength
900nm
Pulse Width
2us
Package Type
SMD
Fall Time
40/60ns
Rise Time
40/60ns
Dimensions
6.8x2.8x1.6
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (min)
2.4V
Operating Supply Voltage (max)
3.6V
Mounting
Surface Mount
Pin Count
6
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Idle Current, Typ @ 25° C
550µA
Link Range, Low Power
50cm
Operating Temperature
-25°C ~ 85°C
Orientation
Side View
Shutdown
*
Size
6.8mm x 2.8mm x 1.6mm
Standards
IrPHY 1.4
Supply Voltage
2.4 V ~ 3.6 V
Lead Free Status / Rohs Status
Compliant
TFBS5700
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS5700 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 4 is VISHAY's recommended profiles for use with
the TFBS5700 transceivers. For more details please
refer to Application note: SMD Assembly Instruction
(http://www.vishay.com/docs/82602/82602.pdf).
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
www.vishay.com
226
260
240
220
200
180
160
140
120
100
Figure 3. Recommended Solder Profile for Sn/Pb soldering
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 4. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
150
Time/s
200
Document Number 84670
50 s max.
20 s
Rev. 2.1, 25-Sep-06
T peak = 260 °C max.
250
2 °C...4 °C/s
300
350