TFBS5700-TR3 Vishay, TFBS5700-TR3 Datasheet - Page 9

• Manufacturer Part Number: TFBS5700-TR3
• Description: TXRX IRDA 1.152MBIT SIDE 6-SMD
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFBS5700-TR3

• Data Rate: 1.125Mbps
• Peak Wavelength: 900nm
• Pulse Width: 2us
• Package Type: SMD
• Fall Time: 40/60ns
• Rise Time: 40/60ns
• Dimensions: 6.8x2.8x1.6
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 6
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Idle Current, Typ @ 25° C: 550µA
• Link Range, Low Power: 50cm
• Operating Temperature: -25°C ~ 85°C
• Orientation: Side View
• Shutdown: *
• Size: 6.8mm x 2.8mm x 1.6mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 3.6 V
• Lead Free Status / Rohs Status: Compliant

TFBS5700
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFBS5700 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 4 is VISHAY's recommended profiles for use with
the TFBS5700 transceivers. For more details please
refer to Application note: SMD Assembly Instruction
(http://www.vishay.com/docs/82602/82602.pdf).
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
www.vishay.com
226
260
240
220
200
180
160
140
120
100
Figure 3. Recommended Solder Profile for Sn/Pb soldering
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
250
90 s max.
300
19431
350
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19261
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2 °C...4 °C/s
Figure 4. Solder Profile, RSS Recommendation
50
T ≥ 255 °C for 20 s max
T ≥ 217 °C for 50 s max
100
90 s...120 s
150
Time/s
200
Document Number 84670
50 s max.
20 s
Rev. 2.1, 25-Sep-06
T peak = 260 °C max.
250
2 °C...4 °C/s
300
350