DS90UR241QVS National Semiconductor, DS90UR241QVS Datasheet - Page 21
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DS90UR241QVS
Manufacturer Part Number
DS90UR241QVS
Description
Manufacturer
National Semiconductor
Datasheet
1.DS90UR241QVS.pdf
(26 pages)
Specifications of DS90UR241QVS
Number Of Elements
1
Number Of Receivers
24
Number Of Drivers
1
Input Type
CMOS
Operating Supply Voltage (typ)
3.3V
Output Type
Serializer
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant
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PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS
Circuit board layout and stack-up for the LVDS SERDES de-
vices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high fre-
quency or high-level inputs and outputs to minimize unwanted
stray noise pickup, feedback and interference. Power system
performance may be greatly improved by using thin di-
electrics (2 to 4 mils) for power / ground sandwiches. This
arrangement provides plane capacitance for the PCB power
system with low-inductance parasitics, which has proven es-
pecially effective at high frequencies, and makes the value
and placement of external bypass capacitors less critical. Ex-
FIGURE 19. DS90UR124 Typical Application Connection
21
ternal bypass capacitors should include both RF ceramic and
tantalum electrolytic types. RF capacitors may use values in
the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be
in the 2.2 uF to 10 uF range. Voltage rating of the tantalum
capacitors should be at least 5X the power supply voltage
being used.
Surface mount capacitors are recommended due to their
smaller parasitics. When using multiple capacitors per supply
pin, locate the smaller value closer to the pin. A large bulk
capacitor is recommend at the point of power entry. This is
typically in the 50uF to 100uF range and will smooth low fre-
quency switching noise. It is recommended to connect power
20194523
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