MT47H64M16HW-3:H Micron Technology Inc, MT47H64M16HW-3:H Datasheet - Page 55

no-image

MT47H64M16HW-3:H

Manufacturer Part Number
MT47H64M16HW-3:H
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H64M16HW-3:H

Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT47H64M16HW-3:H
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Company:
Part Number:
MT47H64M16HW-3:H
Quantity:
539
Power and Ground Clamp Characteristics
Table 25: Input Clamp Characteristics
Figure 20: Input Clamp Characteristics
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
Voltage Across Clamp (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Power and ground clamps are provided on the following input-only balls: Address balls,
bank address balls, CS#, RAS#, CAS#, WE#, ODT, and CKE.
25
20
15
10
5
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
Minimum Power Clamp Current
Voltage Across Clamp (V)
(mA)
55
11.0
13.5
16.0
18.2
21.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
1.0
2.5
4.7
6.8
9.1
Power and Ground Clamp Characteristics
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
Minimum Ground Clamp Current
© 2004 Micron Technology, Inc. All rights reserved.
(mA)
11.0
13.5
16.0
18.2
21.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
1.0
2.5
4.7
6.8
9.1

Related parts for MT47H64M16HW-3:H