ATH030A0X3-SRZ Lineage Power, ATH030A0X3-SRZ Datasheet - Page 16

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ATH030A0X3-SRZ

Manufacturer Part Number
ATH030A0X3-SRZ
Description
Module DC-DC 1-OUT 0.8V to 3.63V 30A 10-Pin SMT T/R
Manufacturer
Lineage Power
Type
Step Downr
Series
ATH030r
Datasheet

Specifications of ATH030A0X3-SRZ

Package
10SMT
Output Current
30 A
Output Voltage
0.8 to 3.63 V
Input Voltage
5 V
Number Of Outputs
1
Switching Regulator
Yes
Product
Non-Isolated / POL
Output Power
109 W
Input Voltage Range
4.5 V to 5.5 V
Output Voltage (channel 1)
0.8 V to 3.63 V
Output Current (channel 1)
30 A
Package / Case Size
SMD
Output Type
Non-Isolated
Package / Case
SMD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Wind Tunnel
Data Sheet
October 2, 2009
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should always
be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-up is
shown in Figure 47. Note that the airflow is parallel to
the long axis of the module as shown in Figure 48. The
derating data applies to airflow in either direction of the
module’s long axis.
Figure 47. Thermal Test Set-up.
LINEAGE
PWBs
POWER
flow
Air
(0.50)
x
12.7_
(3.0)
76.2_
25.4_
(1.0)
4.5 – 5.5Vdc input; 0.8 – 3.63Vdc output; 30A output current
Probe Location
for measuring
airflow and
ambient
temperature
Power Module
6.0 – 14Vdc input; 0.8 – 5.5Vdc output; 25A output current
Austin MegaLynx
Figure 48. T ref Temperature measurement location.
The thermal reference point, T
specifications is shown in Figure 48. For reliable
operation this temperature should not exceed 125
The output power of the module should not exceed the
rated power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
TM
: Non-Isolated DC-DC Power Modules:
Back View
ref
used in the
16
o
C.

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