CC109130481 Lineage Power, CC109130481 Datasheet - Page 22

• Manufacturer Part Number: CC109130481
• Description: Module DC-DC 1-OUT 0.6V to 3.63V 12A 10-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of CC109130481

• Package: 10SMT
• Output Current: 12 A
• Output Voltage: 0.6 to 3.63 V
• Input Voltage: 12 V
• Number Of Outputs: 1
• Switching Regulator: Yes

Data Sheet
April 7, 2011
Surface Mount Information
Pick and Place
The Micro TLynx
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
place operations. The label meets all the requirements
for surface mount processing, as well as safety
standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly
is attempted, components may fall off the module
during the second reflow process. If assembly on the
bottom side is planned, please contact Lineage Power
for special manufacturing process instructions.
Only ruggedized (-D version) modules with additional
epoxy will work with a customer’s first side assembly.
For other versions, first side assembly should be
avoided
Lead Free Soldering
The Micro TLynx
and RoHS compliant and fully compatible in a Pb-free
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev.
C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL
classification procedures. This standard provides
a recommended forced-air-convection reflow
profile based on the volume and thickness of the
package (table 4-2). The suggested Pb-free
solder paste is Sn/Ag/Cu (SAC).
stencil is recommended.
LINEAGE
POWER
TM
TM
modules use an open frame
modules are lead-free (Pb-free)
o
C. The label also carries
2.4 – 5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A output current
A 6 mil thick
Micro TLynx
For questions regarding Land grid array(LGA)
soldering, solder volume; please contact Lineage
Power for special manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 47. Soldering outside of the
recommended profile requires testing to verify results
and performance.
MSL Rating
The Micro TLynx
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 47. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
TM
: Non-isolated DC-DC Power Modules:
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
TM
modules have a MSL rating of 2.
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
22