BLM18RK471SN1D Murata Electronics, BLM18RK471SN1D Datasheet - Page 182

• Manufacturer Part Number: BLM18RK471SN1D
• Description: EMI Filter 0.2A Flat Style SMD
• Manufacturer: Murata Electronics
• Type: EMI Suppression Filterr

Specifications of BLM18RK471SN1D

• Case Size: 0603
• Maximum Current Rating: 0.2 A
• Termination: Flat Style

PL
o
!Note
180
1. Standard Land Pattern Dimensions
PLT10H
2. Solder Paste Printing and Adhesive Application
PLT10H
PCB Warping
When reflow soldering the
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
p
Chip Common Mode Choke Coil
oGuideline of solder paste thickness:
*Solderability is subject to reflow conditions and thermal conductivity. Please make sure that your
oReflow Soldering
product has been evaluated in view of your specifications with our product being mounted to your
product.
150-200 m: PLT10H
For the solder paste printing pattern, use standard land dimensions.
chip common mode choke
4.0
PLT10H
8.0
4.0
Solder Paste Printing
Copper Foil Pattern
Copper Foil Pattern + Resist
Resist
When flow soldering the
apply the adhesive in accordance with the following
conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
Soldering and Mounting
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Poor example
chip common mode choke
Good example
b
a
(in mm)
coils,
Mar.28,2011
C31E.pdf