MC14011BCP ON Semiconductor, MC14011BCP Datasheet - Page 11

• Manufacturer Part Number: MC14011BCP
• Manufacturer: ON Semiconductor

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
G
14X
−V−
A
K
0.10 (0.004)
REF
8
7
M
−U−
PLASTIC TSSOP PACKAGE
PACKAGE DIMENSIONS
B
T
H
MC14001B Series
U
http://onsemi.com
J J1
CASE 948G−01
N
S
DT SUFFIX
N
DETAIL E
ISSUE O
V
S
DETAIL E
11
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
G
M
A
B
C
D
F
H
K
L
J
MILLIMETERS
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
MIN
−−−
0.65 BSC
6.40 BSC
0
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_