1-2013928-5 TE Connectivity, 1-2013928-5 Datasheet - Page 2

• Manufacturer Part Number: 1-2013928-5
• Description: EMBOSS TAPING 0.3FPC NARROW BFU-0.9H 39P
• Manufacturer: TE Connectivity

Specifications of 1-2013928-5

• Product Type: PCB
• Pitch: 0.3 mm
• Number Of Positions / Contacts: 39
• Mounting Angle: Right
• Mounting Style: SMD/SMT
• Actuation Type: ZIF
• Contact Location: Bottom Contact
• Termination Style: Solder Pin
• Wire Type: FPC
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Alignment: Without
• Pcb Mount Retention: Without
• Actuator Type: Rear Flip (Front Hinge)
• Shrouded: Yes
• Sealed: No
• Strain Relief: Without
• Contact Current Rating, Max (a): 0.2
• Operating Voltage Reference: AC
• Operating Voltage (vac): 50
• Shielded: No
• Tail Orientation: Staggered
• Profile Height (y-axis) (mm [in]): 0.90 [0.035]
• Centerline (mm [in]): 0.30 [0.012]
• Number Of Positions: 39
• Selectively Loaded: No
• Pcb Mount Retention Type: Solder Pads
• Length (x-axis) (mm [in]): 12.20 [0.480]
• Width (z-axis) (mm [in]): 3.80 [0.1496]
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.1 [3.937]
• Tail Plating Material: Gold
• Tail Plating, Thickness (µm [?in]): 0.1 [3.93]
• Contact Design: Single Beam
• Housing Material: Thermoplastic
• Contact Mating Location: Bottom
• Flex Cable Thickness (mm [in]): 0.2 [0.008]
• Housing Color: Natural
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -25 – +85 [-13 – +185]
• Zif/non-zif: ZIF
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Tape & Reel

3.
3.1 設計と構造
3.2 材 料
3.3 定 格
A. 定格電圧 50V
B. 定格電流 0.2A （1極当たり）
C. 使用温度範囲 -25℃～85℃ （コネクタ温度上昇含む）
試料は完全に管理された製品を使用し、 プリント基板を
使用する場合は、 本コネクタ推奨基板に適合したものを
使用すること。 試験は特別に規定されない限り以下に示
す環境条件のもとで行われること。
Rev. A
3.4 性能必要条件と試験方法
温度:15℃～35℃、湿度:45%～75%(RH)
気圧:650mmHg～800mmHg
A. コンタクト
（１） 材質：銅合金
（２） 表面処理：
C. アクチュエーター
製品は該当製品図面に規定された設計、構造、物理
的寸法をもって製造されていること。
B. ハウジング
一般必要条件
材質：高耐熱性樹脂, UL94V-0
材質：高耐熱性樹脂, UL94V-0
全面ニッケル下地めっき
接触部、はんだ付け部 金めっき
Product Specification
3. Requirements:
3.1
Product shall be of the design, construction and
physical dimensions specified on the applicable
product drawing.
3.2
A.
B.
C.
Material: Thermo Plastic, UL94V-0
3.4
Descriptions: Test specimens must be completely
controlled products, and the printed circuit
boards must be recommended. All tests are performed
at following condition unless otherwise specified.
3.3
(1) Material: Copper Alloy
(2) Finish: All over
A. Voltage Rating: 50V
B. Current Rating: 0.2A (at 1 Pos.)
C. Temperature Rating: -25℃ to 85℃ (Including
Temperature:15℃～35℃
Humidity
Pressure
Contact
Housing
Actuator
Design and Construction:
Materials:
Material: Thermo Plastic, UL94V-0
Ratings:
Performance Requirements and Test
Under Ni Plating
Au Plating
:45%～75% R.H.
:650mmHg～800mmHg
temperature rising.)
108-78574
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