AD7839AS Analog Devices Inc, AD7839AS Datasheet - Page 4

• Manufacturer Part Number: AD7839AS
• Description: IC DAC 13BIT OCTAL V-OUT 44-MQFP
• Manufacturer: Analog Devices Inc

Specifications of AD7839AS

• Rohs Status: RoHS non-compliant
• Settling Time: 30µs
• Number Of Bits: 13
• Data Interface: Parallel
• Number Of Converters: 8
• Voltage Supply Source: Analog and Digital, Dual ±
• Power Dissipation (max): 303mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 44-MQFP, 44-PQFP
• For Use With: EVAL-AD7839EBZ - BOARD EVAL FOR AD7839

ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Digital Inputs to GND . . . . . . . . . . . . . . –0.3 V, V
V
V
V
DUTGND to GND . . . . . . . . . . . . . V
V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature (T
MQFP Package
AD7839
CC
DD
SS
REF
REF
REF
OUT
A
(Whichever Is Lower)
Industrial (A Version) . . . . . . . . . . . . . . . . –40 C to +85 C
Power Dissipation . . . . . . . . . . . . . . . . . . (T
= +25 C unless otherwise noted)
JA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
to GND
(+) to V
(+) to GND . . . . . . . . . . . . . . . V
(–) to GND . . . . . . . . . . . . . . . V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
(A–H) to GND . . . . . . . . . . . . V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95 C/W
REF
3
. . . . . . . . . . . . . . .–0.3 V, +7 V or V
(–) . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V
J
Model
AD7839AS
*S = Plastic Quad Flatpack (MQFP).
max) . . . . . . . . . . . . . . . . . . +150 C
DUTGND_AB
1, 2
V
V
REF
REF
SS
SS
SS
SS
V
LDAC
(+)AB
(–)AB
OUT
– 0.3 V, V
– 0.3 V, V
– 0.3 V, V
– 0.3 V, V
V
V
CS
A2
A1
A0
DD
SS
Temperature
–40 C to +85 C
Range
A
10
11
1
2
3
4
5
6
7
8
9
J
max – T
12
44
PIN 1
IDENTIFIER
DD
DD
DD
DD
CC
DD
PIN CONFIGURATION
43
13
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
ORDERING GUIDE
42
14
A
)
15
41
(Not to Scale)
JA
TOP VIEW
40
16
AD7839
–4–
39
17
Linearity
Error
(LSBs)
2
Lead Temperature, Soldering
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V
NOTES
1
2
3
38
18
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Transient currents of up to 100 mA will not cause SCR latch-up.
V
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
during power supply sequencing, the following diode protection scheme will ensure
protection.
CC
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
19
37
must not exceed V
20
36
21
35
22
34
DNL
(LSBs)
33
32
31
30
29
28
27
26
25
24
23
1
DUTGND_GH
V
V
V
V
CLR
DB12
DB11
DB10
DB9
DB8
DD
OUT
REF
REF
SS
by more than 0.3 V. If it is possible for this to happen
H
(–)GH
(+)GH
IN4148
V
V
DD
DD
HP5082-2811
AD7839
Package
Option*
S-44
V
V
CC
CC
REV. 0