XC9536XL-10PCG44C Xilinx Inc, XC9536XL-10PCG44C Datasheet

XC9536XL-10PCG44C

Manufacturer Part Number

XC9536XL-10PCG44C

Description

IC CPLD 36 MCELL 3.3V 44-PLCC

Manufacturer

Xilinx Inc

Series

XC9500XLr

Datasheets

1.XC9536XL-10VQG44C.pdf (10 pages)

2.XC9536XL-10PCG44C.pdf (4 pages)

Specifications of XC9536XL-10PCG44C

Programmable Type

In System Programmable (min 10K program/erase cycles)

Delay Time Tpd(1) Max

10.0ns

Voltage Supply - Internal

3 V ~ 3.6 V

Number Of Logic Elements/blocks

Number Of Macrocells

Number Of Gates

800

Number Of I /o

Operating Temperature

0°C ~ 70°C

Mounting Type

Surface Mount

Package / Case

44-PLCC

Features

Programmable

Voltage

3.0 V ~ 3.6 V

Memory Type

FLASH

Cpld Type

FLASH

No. Of Macrocells

No. Of I/o's

Propagation Delay

10ns

Global Clock Setup Time

6.5ns

Frequency

100MHz

Supply Voltage Range

3V To 3.6V

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Number Of Logic Elements/cells

Lead Free Status / RoHS Status

Lead free / RoHS Compliant, Lead free / RoHS Compliant

Other names

122-1570

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

XC9536XL-10PCG44C

Manufacturer:

XILINX

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Manufacturer:

XILINX

Quantity:

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Manufacturer:

Xilinx Inc

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Manufacturer:

XILINX

Company:

BOSTOCK HK LIMITED

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XC9536XL-10PCG44C

Manufacturer:

XILINX

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Meier Automation Equipment Co., Limited

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Manufacturer:

XILOINX

Quantity:

20 000

Company:

Amily Shenzhen XNWY Technology Co., Ltd

Part Number:

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Company:

H&T Electronics

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Quantity:

1 900

Current page: 1 of 4
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XCN05015 (v1.0) October 3, 2005

Overview

The purpose of this notification is to communicate a change in the wafer fabrication facility for the XC95288XL and

XC9536XL CPLD devices.

Description

The XC95288XL and XC9536XL CPLD devices will transition from a 0.35μm four-layer metal Flash CMOS process at UMC,

Taiwan, to a 0.35μm four-layer metal Flash CMOS process at He Jian Technology Company, China. This will complete the

transition of the XC9500XL CPLD family, as the XC95144XL and XC9572XL are already in volume production at He Jian.

See XCN05003, released in January 2005, for more information regarding the XC95144XL and XC9572XL product

transitions.

This change improves the ability of Xilinx to support this product effectively, competitively, and to accommodate our

customers’ high-volume demands. There is no difference in fit, form, or function between the latest revisions of these

devices currently fabricated by UMC and those fabricated by He Jian.

This notification is for a change in the wafer fabrication facility only. There are no changes to the assembly or test locations

for the devices covered by this notification.

Upon availability of production units from He Jian of XC95288XL and XC9536XL on January 2, 2006, customers can expect

to receive devices fabricated by either UMC or He Jian until the UMC material is depleted.

Products Affected

This change affects all speed, package, and temperature variations of the commercial and industrial grade XC95288XL and

XC9536XL devices. Q grade devices are not affected by this PCN. Affected part numbers are included in the following lists:

XCN05015 (v1.0) October 3, 2005

XC95288XL-10BG256C

XC95288XL-10CS280C

XC95288XL-10FG256C

XC95288XL-10PQ208C

XC95288XL-10TQ144C

XC95288XL-10BGG256C

XC95288XL-10CSG280C

XC95288XL-10FGG256C

XC95288XL-10PQG208C

XC95288XL-10TQG144C

XC9536XL-10CS48C

XC9536XL-10PC44C

XC9536XL-10VQ44C

XC9536XL-10VQ64C

XC9536XL-10CSG48C

XC9536XL-10PCG44C

XC9536XL-10VQG44C

XC9536XL-10VQG64C

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

XC9536XL-10CS48I

XC9536XL-10PC44I

XC9536XL-10VQ44I

XC9536XL-10VQ64I

XC9536XL-10CSG48I

XC9536XL-10PCG44I

XC9536XL-10VQG44I

XC9536XL-10VQG64I

XC95288XL-10BG256I

XC95288XL-10CS280I

XC95288XL-10FG256I

XC95288XL-10PQ208I

XC95288XL-10TQ144I

XC95288XL-10BGG256I

XC95288XL-10CSG280I

XC95288XL-10FGG256I

XC95288XL-10PQG208I

XC95288XL-10TQG144I

XC9536XL-5CS48C

XC9536XL-5PC44C

XC9536XL-5VQ44C

XC9536XL-5VQ64C

XC9536XL-5CSG48C

XC9536XL-5PCG44C

XC9536XL-5VQG44C

XC9536XL-5VQG64C

XC95288XL-6BG256C

XC95288XL-6CS280C

XC95288XL-6FG256C

XC95288XL-6PQ208C

XC95288XL-6TQ144C

XC95288XL-6BGG256C

XC95288XL-6CSG280C

XC95288XL-6FGG256C

XC95288XL-6PQG208C

XC95288XL-6TQG144C

www.xilinx.com

Change in Wafer Fabrication

Facility for XC95288XL and

XC9536XL CPLDs

XC9536XL-7CS48C

XC9536XL-7PC44C

XC9536XL-7VQ44C

XC9536XL-7VQ64C

XC9536XL-7CSG48C

XC9536XL-7PCG44C

XC9536XL-7VQG44C

XC9536XL-7VQG64C

XC95288XL-7BG256C

XC95288XL-7CS280C

XC95288XL-7FG256C

XC95288XL-7PQ208C

XC95288XL-7TQ144C

XC95288XL-7BGG256C

XC95288XL-7CSG280C

XC95288XL-7FGG256C

XC95288XL-7PQG208C

XC95288XL-7TQG144C

Product/Process Change Notice

XC9536XL-7CS48I

XC9536XL-7PC44I

XC9536XL-7VQ44I

XC9536XL-7VQ64I

XC9536XL-7CSG48I

XC9536XL-7PCG44I

XC9536XL-7VQG44I

XC9536XL-7VQG64I

XC95288XL-7BG256I

XC95288XL-7CS280I

XC95288XL-7FG256I

XC95288XL-7PQ208I

XC95288XL-7TQ144I

XC95288XL-7BGG256I

XC95288XL-7CSG280I

XC95288XL-7FGG256I

XC95288XL-7PQG208I

XC95288XL-7TQG144I

Related parts for XC9536XL-10PCG44C

XC9536XL-10PCG44C Summary of contents

Page 1

... XC9536XL-10PC44I XC9536XL-10VQ44C XC9536XL-10VQ44I XC9536XL-10VQ64C XC9536XL-10VQ64I XC9536XL-10CSG48C XC9536XL-10CSG48I XC9536XL-10PCG44C XC9536XL-10PCG44I XC9536XL-10VQG44C XC9536XL-10VQG44I XC9536XL-10VQG64C XC9536XL-10VQG64I © 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. ...

Page 2

... XC95288XL-10TQ144C0962). The ordering code 0962 will not be marked on the package topmark. Upon availability of production units from He Jian of the XC95288XL and the XC9536XL devices on January 2, 2006, cus- tomers can expect to receive devices fabricated by either UMC or He Jian until the UMC material is depleted. The last time buy (LTB) date for product specifically fabricated at UMC in Taiwan is June 26, 2006, with shipment requested before December 29, 2006 (Last Time Ship - LTS) ...

Page 3

... Table 3: Process Reliability Data: 0.35mm He Jian Process Reliability Data (Wafer Level Reliability Data) Mechanism Sample Size HCI 3 lots, 20 units/lot TDDB 3 lots, 20 units/lot EM 3 lots, 20 units/lot XCN05015 (v1.0) October 3, 2005 Change in Wafer Fabrication Facility for XC95288XL and XC9536XL CPLDs Test conditions Device XC95288XL HBM JESD22-A-114 XC9536XL XC95288XL JESD78 XC9536XL Condition of ...

Page 4

... For instructions on how to sign up, refer to Revision History The following table shows the revision history for this document. Date Version 10/03/05 1.0 XCN05015 (v1.0) October 3, 2005 Change in Wafer Fabrication Facility for XC95288XL and XC9536XL CPLDs Xilinx Answer Record 18683. Initial release. www.xilinx.com Xilinx Technical Support. Revision 4 ...

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