XC2S50E-6FTG256C Xilinx Inc, XC2S50E-6FTG256C Datasheet - Page 56

IC SPARTAN-IIE FPGA 50K 256FTBGA

XC2S50E-6FTG256C

Manufacturer Part Number
XC2S50E-6FTG256C
Description
IC SPARTAN-IIE FPGA 50K 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-IIEr
Datasheet

Specifications of XC2S50E-6FTG256C

Number Of Logic Elements/cells
1728
Number Of Labs/clbs
384
Total Ram Bits
32768
Number Of I /o
182
Number Of Gates
50000
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1328

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC2S50E-6FTG256C
Manufacturer:
ISSI
Quantity:
1 001
Part Number:
XC2S50E-6FTG256C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC2S50E-6FTG256C
Manufacturer:
XILINX
0
Part Number:
XC2S50E-6FTG256C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Spartan-IIE FPGA Family: Pinout Tables
Package Thermal Characteristics
Table 14
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
(www.xilinx.com/cgi-bin/thermal/thermal.pl).
The junction-to-case thermal resistance (θ
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (θ
Table 14: Spartan-IIE Package Thermal Characteristics
56
Package
TQG144
PQG208
FGG456
FGG676
FTG256
PQ208
TQ144
FG456
FG676
FT256
provides the thermal characteristics for the various
XC2S100E
XC2S100E
XC2S150E
XC2S200E
XC2S300E
XC2S100E
XC2S150E
XC2S200E
XC2S300E
XC2S400E
XC2S100E
XC2S150E
XC2S200E
XC2S300E
XC2S400E
XC2S600E
XC2S400E
XC2S600E
XC2S50E
XC2S50E
XC2S50E
Device
Junction-to-Case
5.8
5.3
7.1
6.1
6.0
4.6
4.0
7.3
5.8
5.7
3.9
3.2
2.5
8.4
8.2
6.3
5.6
3.6
2.7
4.1
3.4
JC
)
JC
) indicates the
Junction-to-
Board (θ
JB
)
www.xilinx.com
17.8
15.1
14.8
11.4
10.1
14.9
14.6
11.6
10.4
N/A
N/A
N/A
N/A
N/A
N/A
N/A
8.8
6.5
5.0
7.9
6.9
JB
)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (θ
reports the temperature difference between the ambient
environment and the junction temperature. The θ
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θ
drops with increasing air flow.
JA
Still Air
(0 LFM)
value in a system without a fan. The thermal resistance
32.3
31.4
35.1
34.2
34.1
32.4
31.6
27.4
25.0
24.8
21.9
20.8
19.7
24.3
24.1
21.0
19.9
17.7
17.3
15.6
14.5
Junction-to-Ambient (θ
at Different Air Flows
250 LFM
25.1
24.4
25.9
25.2
25.2
23.9
23.3
21.6
19.5
19.3
16.6
15.6
14.5
19.2
19.0
16.1
15.1
11.7
11.2
11.1
9.9
500 LFM
21.5
20.8
22.9
22.3
22.2
21.2
20.6
20.4
18.2
18.0
15.2
14.2
13.2
18.1
17.9
15.0
13.9
10.5
10.0
9.8
8.6
DS077-4 (2.3) June 18, 2008
JA
)
750 LFM
Product Specification
20.1
19.6
21.2
20.7
20.6
19.6
19.1
20.0
17.8
17.6
14.7
13.7
12.6
17.4
17.1
14.3
13.2
10.0
9.5
9.2
7.9
JA
JA
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
) value
Units
value is
R

Related parts for XC2S50E-6FTG256C