XC3S200AN-4FTG256I Xilinx Inc, XC3S200AN-4FTG256I Datasheet - Page 4

IC SPARTAN-3AN FPGA 200K 256FTBG

XC3S200AN-4FTG256I

Manufacturer Part Number
XC3S200AN-4FTG256I
Description
IC SPARTAN-3AN FPGA 200K 256FTBG
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr

Specifications of XC3S200AN-4FTG256I

Total Ram Bits
294912
Number Of Logic Elements/cells
4032
Number Of Labs/clbs
448
Number Of I /o
195
Number Of Gates
200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
No. Of Logic Blocks
448
No. Of Gates
200000
No. Of Macrocells
4032
Family Type
Spartan-3AN
No. Of Speed Grades
4
No. Of I/o's
195
Clock
RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1569

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC3S200AN-4FTG256I
Manufacturer:
ATMEL
Quantity:
301
Part Number:
XC3S200AN-4FTG256I
Quantity:
100
Part Number:
XC3S200AN-4FTG256I
Manufacturer:
XILINX
0
Part Number:
XC3S200AN-4FTG256I
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Part Number:
XC3S200AN-4FTG256I
0
Company:
Part Number:
XC3S200AN-4FTG256I
Quantity:
2 500
Part Number:
XC3S200AN-4FTG256I4346
Manufacturer:
XILINX
0
Table 2: Available User I/Os
Package Marking
Figure 1
Spartan-3A family in the quad-flat packages.
shows the top marking for the Extended Spartan-3A family
in BGA packages. The markings for the BGA packages are
nearly identical to those for the quad-flat packages, except
X-Ref Target - Figure 1
X-Ref Target - Figure 2
DS706 (v1.1) February 2, 2011
Product Specification
Notes:
1.
2.
XC3S50A/AN
XC3S200A/AN
XC3S400A/AN
XC3S700A/AN
XC3S1400A/AN
XC3SD1800A
XC3SD3400A
Body Size (mm)
The footprints for the VQ/TQ packages are larger than the package body. See the package drawings
(http://www.xilinx.com/support/documentation/package_specifications.htm) for details.
These options are available only in the Spartan-3A devices, not the Spartan-3AN devices. See the data sheets for each device for Pb and
Pb-free package option availability.
Device
provides a top marking example for the Extended
R
14 x 14
VQG100
Figure 2: Extended Spartan-3A Device BGA Package Marking Example
Figure 1: Extended Spartan-3A Device QFP Package Marking Example
VQ100
68
68
Temperature Range
-
-
-
-
-
(2)
(2)
Temperature Range
(1)
Speed Grade
Device Type
Speed Grade
Device Type
BGA Ball A1
Package
20 x 20
TQG144
TQ144
Package
108
Pin P1
-
-
-
-
-
-
(1)
Figure 2
FTG256
17 x 17
FT256
161
161
144
195
195
-
-
SPARTAN
SPARTAN
XC3S50A
FT256 AGQ0625
D1234567A
4C
(2)
(2)
XC3S50A
TQ144AGQ0625
D1234567A
4C
www.xilinx.com
FGG320
TM
19 x 19
FG320
R
R
TM
248
251
that the marking is rotated with respect to the ball A1
indicator.
The “5C” and “4I” Speed Grade/Temperature Range part
combinations might be dual marked as “5C/4I”.
R
R
-
-
-
-
-
(2)
(2)
FGG400
21 x 21
FG400
311
311
-
-
-
-
-
Date Code
Lot Code
Mask Revision Code
Fabrication Code
Process Code
(2)
Mask Revision Code
Fabrication Code
Process Technology
Date Code
Lot Code
Extended Spartan-3A Family Overview
DS706_02_072508
CSG484
19 x 19
CS484
DS706_01_072508
309
309
-
-
-
-
-
FGG484
23 x 23
FG484
372
375
-
-
-
-
-
FGG676
27 x 27
FG676
502
519
469
-
-
-
-
4

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