XC3S1400AN-4FGG676C Xilinx Inc, XC3S1400AN-4FGG676C Datasheet - Page 2
![IC SPARTAN-3AN FPGA 1400K 676FBG](/photos/6/73/67300/b-676_sml.jpg)
XC3S1400AN-4FGG676C
Manufacturer Part Number
XC3S1400AN-4FGG676C
Description
IC SPARTAN-3AN FPGA 1400K 676FBG
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheets
1.XC3S50A-4VQG100C.pdf
(7 pages)
2.XC3S50AN-4TQG144C.pdf
(2 pages)
3.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S1400AN-4FGG676C
Total Ram Bits
589824
Number Of Logic Elements/cells
25344
Number Of Labs/clbs
2816
Number Of I /o
502
Number Of Gates
1400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
676-BBGA
No. Of Logic Blocks
25344
No. Of Gates
1400000
No. Of Macrocells
25344
Family Type
Spartan-3AN
No. Of Speed Grades
4
No. Of I/o's
502
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1552
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1400AN-4FGG676C
Manufacturer:
XILINX
Quantity:
201
Company:
Part Number:
XC3S1400AN-4FGG676C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S1400AN-4FGG676C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Industry’s first 90nm FPGA with Electronic Serial Numbering
Each FPGA includes a permanent unique Device DNA serial number and Factory Flash ID.
Designers have complete flexibility in implementing highly customized algorithms for both
authentication, as well as non-authentication responses such as limited-functionality,
time-bomb, and self-destruct. This can significantly deter reverse-engineering, cloning,
and overbuilding.
Industry’s Largest On-Chip User Flash
The new Spartan-3AN platform boasts the industry’s largest on-chip user flash with a
capacity of up to 11Mb. It provides simple and secure embedded application storage,
while also enabling advanced real-time control with fine-grained protection, lockdown
and erase features.
Widest Support for I/O Standards
The Spartan-3AN FPGA is especially suitable for display devices supporting both TMDS and
PPDS standards. With support for 26 popular single-ended and differential signaling standards
including LVDS, RSDS, SSTL3 Class I & II, full hot-swap compliance, and pre-engineered
interface IP solutions such as PCI, PCI Express, USB, Firewire, CAN, SPI, and I2C, the
Spartan-3AN platform provides an industry-leading connectivity solution.
Flexible Power-Management Modes
The “Suspend” Mode in Spartan-3AN FPGAs provides a very flexible and effective way to
preserve power. In this mode, the total FPGA power is reduced by more than 40%. The
configuration data as well as flip-flop and RAM values are also maintained. In addition, it
includes a fast wake-up mechanism and system level synchronization across time domains.
Take the Next Step
Visit our website www.xilinx.com/spartan3an or call your local sale office or distributor for
more information about Spartan-3AN FPGAs. To start your design immediately, download
your free ISE WebPACK
FPGAs, order your hardware development board at www.xilinx.com/s3anstarter
* Spartan-3AN platform is pin compatible with Spartan-3A platform supporting platform migration
Device
System Gates
Logic Cells
Dedicated Multipliers
Block RAM Blocks
Block RAM Bits
Distributed RAM Bits
Flash Size Bits
User Flash Bits
DCMs
I/O Standards
Max Differential I/O
Max Single Ended I/O
Device
TQ144 20 x 20 mm
FT256 17 x 17 mm
FG400 21 x 21 mm
FG484 23 x 23 mm
FG676 27 x 27 mm
TM
design tools at www.xilinx.com/ise. To begin evaluating Spartan-3AN
Spartan-3AN FPGA Platform
XC3S50AN
50K
1,584
3
3
54K
11K
1M
627K
2
26
50
108
Package and I/O Offerings
XC3S50AN
108
XC3S200AN
200K
4,032
16
16
288K
28K
4M
2M
4
26
90
195
XC3S200AN
195
XC3S400AN
400K
8,064
20
20
360K
56K
4M
2M
4
26
142
311
XC3S400AN
311
XC3S700AN
700K
13,248
20
20
360K
92K
8M
5M
8
26
165
372
XC3S700AN
372
XC3S1400AN
1400K
25,344
32
32
576K
176K
16M
11M
8
26
227
502
XC3S1400AN
502
www.xilinx.com
Copyright © 2OO7 Xilinx, Inc. All rights reserved. XILINX, the Xilinx Logo, and other
designated brands included herein are trademarks of Xilinx, Inc. All other trademarks
are the property of their respective owners
Printed in U.S.A. PN 2011
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