EP3C5F256I7N Altera, EP3C5F256I7N Datasheet - Page 12
![IC CYCLONE III FPGA 5K 256 FBGA](/photos/6/70/67063/544-256-fbga_sml.jpg)
EP3C5F256I7N
Manufacturer Part Number
EP3C5F256I7N
Description
IC CYCLONE III FPGA 5K 256 FBGA
Manufacturer
Altera
Series
Cyclone® IIIr
Datasheets
1.EP3C5F256C8N.pdf
(5 pages)
2.EP3C5F256C8N.pdf
(34 pages)
3.EP3C5F256C8N.pdf
(66 pages)
4.EP3C5F256C8N.pdf
(14 pages)
5.EP3C5F256C8N.pdf
(76 pages)
6.EP3C5F256I7N.pdf
(274 pages)
Specifications of EP3C5F256I7N
Number Of Logic Elements/cells
5136
Number Of Labs/clbs
321
Total Ram Bits
423936
Number Of I /o
182
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
5136
# I/os (max)
182
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
5136
Ram Bits
423936
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
FBGA
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2558
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP3C5F256I7N
Manufacturer:
ALTERA32
Quantity:
1 608
Part Number:
EP3C5F256I7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
1–12
Reference and Ordering Information
Figure 1–1. Cyclone III Device Packaging Ordering Information
Figure 1–2. Cyclone III LS Device Packaging Ordering Information
Cyclone III Device Handbook, Volume 1
EP3C: Cyclone III
5
10
16
25
25E
40
55
80
120
E: Plastic Enhanced Quad Flat Pack (EQFP)
Q: Plastic Quad Flat Pack (PQFP)
F: FineLine Ball-Grid Array (FBGA)
U: Ultra FineLine Ball-Grid Array (UBGA)
M: Micro FineLine Ball-Grid Array (MBGA)
EP3CLS: Cyclone III LS
70
100
150
200
F: FineLine Ball-Grid Array (FBGA)
U: Ultra FineLine Ball-Grid Array (UBGA)
Package Type
Device Type
Family Signature
Package Type
Device Type
Family Signature
Figure 1–1
devices.
EP3C
EP3CLS
and
25
70
Figure 1–2
F
F
Number of pins for a particular package:
144
164
240
256
324
484
780
Number of pins for a particular package:
484
780
Pin Count
324
Pin Count
484
show the ordering codes for Cyclone III and Cyclone III LS
C
C
7
7
N
N
Indicates specific device options or
shipment method.
ES: Engineering sample
N: Lead-free devices
6 (fastest)
7
8
C: Commercial temperature (T
I: Industrial temperature (T
A: Automotive temperature (T
Indicates specific device options or
shipment method.
ES: Engineering sample
N: Lead-free devices
7 (fastest)
8
C: Commercial temperature (T
I: Industrial temperature (T
Operating Temperature
Speed Grade
Optional Suffix
Chapter 1: Cyclone III Device Family Overview
Operating Temperature
Speed Grade
Optional Suffix
© December 2009 Altera Corporation
Reference and Ordering Information
J
J
= -40
J
= -40
J
= -40
J
= 0
= 0
°
C to 100
°
°
C to 100
C to 85
°
°
C to 125
C to 85
°
°
C)
°
C)
°
C)
°
C)
C)