FCN-268M024-G/2D Fujitsu, FCN-268M024-G/2D Datasheet - Page 2

• Manufacturer Part Number: FCN-268M024-G/2D
• Description: I/O Connectors PLUG 24 SIGNAL PAIRS 12mm STACK VERT SMT
• Manufacturer: Fujitsu

Specifications of FCN-268M024-G/2D

• Product: Infiniband Connectors
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

receivers. With noise voltages less of a problem,
differential signals can use a small voltage swing
that switches between LOW and HIGH values
extremely quickly --hence the appeal of differential
signals for high-speed networking and clustering.
Differential connector characteristics can exceed
the requirements of upcoming 1-Gbit applications
and extend to next-generation applications at
speeds upwards of 4.4 Gbps. As a result, system
and board vendors who adopt such a connector can
look forward to legacy usage that spans multiple
product generations.
The signal transmission path of connectors has
not always been a critical issue when choosing
an interconnect method because the connector's
electrical signal path is short compared to cables
or printed circuit board assemblies. In applications
utilizing high-frequency signals, however,
connectors can have a significant effect on signal
integrity. Connectors for high-speed applications
must be designed to achieve optimal performance
through the minimization of crosstalk and
susceptibility to noise influences.
Differential signal applications
The shift from mainframe environments to
networked client/server enterprises has made
networks a critical bottleneck for improving system
performance. Emerging technologies such as
high-speed server farms, video conferencing,
and greater use of graphical interfaces is pushing
networks toward performance of 1 Gbit/sec and
higher. The IEEE 802 committee is releasing 1.028-
Gbit Ethernet standards to meet this requirement.
One of the key challenges for switch, hub, video
equipment, and server manufacturers is to find
a board-to-board connector system that allows
signals to transfer at gigabit speeds over an
affordable interconnect system that furnishes
specific matched-impedance characteristics.
Applications such as servers are now moving
to extremely high-speed interfaces (often
based on Fibre Channel) between computer
backplanes and disk subsystems that require
advance interconnects between boards. Similarly,
Specifications
subject to change
microGiGaCn
Dimensions are in millimeters (inches)
networking hubs incorporate many boards that
must be interconnected via short-run cables.
These internal cables often have to transfer data at
speeds significantly higher than those of the actual
network, so even today's 10/100-Mbit networks
need high-speed internal interconnects with
excellent signal integrity. In addition, any system
that uses an external fiber optic connector probably
requires an internal, board-to-board connector
system that works at the highest possible speeds.
Fiber optic and coax interconnect systems
obviously meet the internal performance
requirements, but the cost is high. Differential
interconnects meet both the performance and
cost goals but until recently, no connectors were
available that provided high-density connections
at gigabit speeds. In addition, connector test
methodologies from the past cannot give
reliable and repeatable results of the differential
connector's performance in high-speed systems.
Therefore, new test methodologies must be
developed based on the unique characteristics of
these emerging high-speed applications.
High-speed differential interconnect
characterization
In the past, connector manufacturers "de-
imbedded" the connector from the test PCB's
to show just the electrical characteristics of the
connector and did not include any parasitic
effects associated with solder joints on a through
hole contact lead, or the effects of the contact
post (compliant or non-compliant pin) in a plated
through hole. While this test methodology was
acceptable for slower system speeds, today's
differential interconnects demand much more
focused attention on system and board effects.
The requirements for testing today's high-speed
differential interconnects are demanding with
good reason. Connectors and other traditionally
"electrically small" components are no longer small
when considering presently available signaling
technologies with 100ps risetimes and multi-gigabit
data rates. Among these requirements are very
well-designed test boards needed for accurate
measurement and characterization. This data is
TM
fCn-260 (D) Series
http://us.fujitsu.com/components
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