XC3S500E-5CPG132C Xilinx Inc, XC3S500E-5CPG132C Datasheet - Page 64
XC3S500E-5CPG132C
Manufacturer Part Number
XC3S500E-5CPG132C
Description
IC FPGA SPARTAN-3E 500K 132CSBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S500E-5CPG132C
Number Of Logic Elements/cells
10476
Number Of Labs/clbs
1164
Total Ram Bits
368640
Number Of I /o
92
Number Of Gates
500000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
132-TFBGA, CSPBGA
For Use With
122-1536 - KIT STARTER SPARTAN-3E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S500E-5CPG132C
Manufacturer:
Xilinx Inc
Quantity:
10 000
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Functional Description
Interconnect
For additional information, refer to the Using Interconnect
chapter in UG331.
Interconnect is the programmable network of signal path-
ways between the inputs and outputs of functional elements
within the FPGA, such as IOBs, CLBs, DCMs, and block
RAM.
Overview
Interconnect, also called routing, is segmented for optimal
connectivity. Functionally, interconnect resources are identi-
cal to that of the Spartan-3 architecture. There are four
kinds of interconnects: long lines, hex lines, double lines,
and direct lines. The Xilinx Place and Route (PAR) software
exploits the rich interconnect array to deliver optimal system
performance and the fastest compile times.
64
Figure 48: Four Types of Interconnect Tiles (CLBs, IOBs, DCMs, and Block RAM/Multiplier)
Switch
Switch
Switch
Matrix
Matrix
Matrix
DCM
CLB
IOB
www.xilinx.com
Switch
Switch
Switch
Switch
Matrix
Matrix
Matrix
Matrix
Switch Matrix
The switch matrix connects to the different kinds of intercon-
nects across the device. An interconnect tile, shown in
Figure
a functional element, such as a CLB, IOB, or DCM. If a func-
tional element spans across multiple switch matrices such
as the block RAM or multipliers, then an interconnect tile is
defined by the number of switch matrices connected to that
functional element. A Spartan-3E device can be repre-
sented as an array of interconnect tiles where interconnect
resources are for the channel between any two adjacent
interconnect tile rows or columns as shown in
48, is defined as a single switch matrix connected to
Block
18Kb
RAM
DS312_08_020905
18 x 18
MULT
DS312-2 (v3.8) August 26, 2009
Product Specification
Figure
49.
R
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