XC3S500E-4FTG256I Xilinx Inc, XC3S500E-4FTG256I Datasheet - Page 43
![IC FPGA SPARTAN-3E 500K 256FTBGA](/photos/6/71/67101/pk053-256_sml.jpg)
XC3S500E-4FTG256I
Manufacturer Part Number
XC3S500E-4FTG256I
Description
IC FPGA SPARTAN-3E 500K 256FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S500E-4FTG256I
Number Of Logic Elements/cells
10476
Number Of Labs/clbs
1164
Total Ram Bits
368640
Number Of I /o
190
Number Of Gates
500000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
Package
256FTBGA
Family Name
Spartan®-3E
Device Logic Cells
10476
Device Logic Units
1164
Device System Gates
500000
Number Of Registers
9312
Maximum Internal Frequency
572 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
190
Ram Bits
368640
For Use With
122-1536 - KIT STARTER SPARTAN-3E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S500E-4FTG256I
Manufacturer:
INTERSIL
Quantity:
4 300
Company:
Part Number:
XC3S500E-4FTG256I
Manufacturer:
XILINX35
Quantity:
350
Company:
Part Number:
XC3S500E-4FTG256I
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S500E-4FTG256I
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Setting the WRITE_MODE attribute to a value of
NO_CHANGE, puts the DO outputs in a latched state when
asserting WE. Under this condition, the DO outputs retain
DS312-2 (v3.8) August 26, 2009
Product Specification
R
Figure 35: Waveforms of Block RAM Data Operations with NO_CHANGE Selected
ADDR
Data_in
CLK
WE
DO
EN
DI
DISABLED
0000
DI
Internal
Memory
XXXX
aa
READ
MEM(aa)
www.xilinx.com
DO
bb
MEM(bb)=1111
1111
WRITE
the data driven just before WE is asserted. NO_CHANGE
timing is shown in the portion of
is High.
No change during write
2222
cc
MEM(cc)=2222
WRITE
dd
DS312-2_07_020905
XXXX
READ
MEM(dd)
Figure 35
Functional Description
during which WE
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