XC3S1000-4FGG320C Xilinx Inc, XC3S1000-4FGG320C Datasheet - Page 63
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XC3S1000-4FGG320C
Manufacturer Part Number
XC3S1000-4FGG320C
Description
SPARTAN-3A FPGA 1M STD 320-FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3r
Datasheet
1.XC3S50-4VQG100C.pdf
(217 pages)
Specifications of XC3S1000-4FGG320C
Number Of Logic Elements/cells
17280
Number Of Labs/clbs
1920
Total Ram Bits
442368
Number Of I /o
221
Number Of Gates
1000000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
320-BGA
Package
320FBGA
Family Name
Spartan®-3
Device Logic Units
17280
Device System Gates
1000000
Maximum Internal Frequency
630 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
221
Ram Bits
442368
For Use With
122-1502 - KIT STARTER SPARTAN-3 PCI-E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1000-4FGG320C
Manufacturer:
MAXIM
Quantity:
100
Company:
Part Number:
XC3S1000-4FGG320C
Manufacturer:
XILINX
Quantity:
490
Company:
Part Number:
XC3S1000-4FGG320C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S1000-4FGG320C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Table 35: DC Characteristics of User I/Os Using Single-Ended Standards (Continued)
DS099-3 (v2.5) December 4, 2009
Product Specification
98
Notes:
1.
2.
3.
4.
5.
6.
7.
LVCMOS33
LVDCI_33,
LVDCI_DV2_33
LVTTL
PCI33_3
SSTL18_I
SSTL18_I_DCI
SSTL18_II
SSTL2_I
SSTL2_I_DCI
SSTL2_II
SSTL2_II_DCI
(IOSTANDARD) and Current
The numbers in this table are based on the conditions set forth in
Descriptions of the symbols used in this table are as follows:
Tested according to the standard’s relevant specifications. When using the DCI version of a standard on a given I/O bank, that bank
will consume more power than if the non-DCI version had been used instead. The additional power is drawn for the purpose of
impedance-matching at the I/O pins. A portion of this power is dissipated in the two R
For the LVCMOS and LVTTL standards: the same V
All dedicated output pins (CCLK, DONE, and TDO) and dual-purpose totem-pole output pins (D0-D7 and BUSY/DOUT) exhibit the
characteristics of LVCMOS25 with 12 mA drive and slow slew rate. For information concerning the use of 3.3V signals, see the
3.3V-Tolerant Configuration Interface, page
Tested according to the relevant PCI specifications. For more information, see XAPP457.
The minimum usable V
I
I
V
V
V
V
V
V
V
OL
OH
Drive Attribute (mA)
OL
OH
IL
IH
CCO
REF
TT
(4)
Signal Standard
–
–
–
–
–
–
–
(7)
–
the input voltage that indicates a Low logic level
the output current condition under which V
the output current condition under which V
the input voltage that indicates a High logic level
–
the voltage applied to a resistor termination
the output voltage that indicates a Low logic level
the output voltage that indicates a High logic level
(4)
R
the reference voltage for setting the input switching threshold
the supply voltage for output drivers as well as LVCMOS, LVTTL, and PCI inputs
(7)
12
16
24
12
16
24
2
4
6
8
2
4
6
8
TT
voltage is 1.25V
Note 3
Note 6
Note 3
Note 3
Note 3
(mA)
13.4
16.2
I
6.7
8.1
12
16
24
12
16
24
OL
2
4
6
8
2
4
6
8
Spartan-3 FPGA Family: DC and Switching Characteristics
46.
Test Conditions
OL
OH
OL
is tested
is tested
www.xilinx.com
and V
OH
limits apply for both the Fast and Slow slew attributes.
Note 3
Note 6
Note 3
Note 3
Note 3
–13.4
–16.2
(mA)
Table 31
–6.7
–8.1
–12
–16
–24
–12
–16
–24
I
–2
–4
–6
–8
–2
–4
–6
–8
OH
and
Table
34.
REF
V
V
0.10V
V
V
TT
TT
Max (V)
resistors.
TT
TT
Logic Level Characteristics
V
0.4
0.4
- 0.475
- 0.475
- 0.61
- 0.81
OL
CCO
V
V
V
V
V
0.90V
TT
TT
CCO
TT
TT
Min (V)
V
2.4
+ 0.475
+ 0.475
+ 0.61
+ 0.81
OH
- 0.4
CCO
63