AP1507-33D5L-13 Diodes Inc, AP1507-33D5L-13 Datasheet - Page 9

Switching Converters, Regulators & Controllers SW REG CNV BUCK ASYN 150K 1.4 22V 3.3V

AP1507-33D5L-13

Manufacturer Part Number
AP1507-33D5L-13
Description
Switching Converters, Regulators & Controllers SW REG CNV BUCK ASYN 150K 1.4 22V 3.3V
Manufacturer
Diodes Inc
Datasheet

Specifications of AP1507-33D5L-13

Output Voltage
3.3 V
Switching Frequency
150 KHz
Operating Temperature Range
- 40 C to + 125 C
Mounting Style
SMD/SMT
Package / Case
TO-252-5L
Duty Cycle (max)
0 % to 100 %
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AP1507-33D5L-13
Manufacturer:
DIOEDS
Quantity:
20 000
Applications Information
Pin Functions
+V
This is the positive input supply for the IC switching regulator. A
suitable input bypass capacitor must be present at this pin to
minimize voltage transients and to supply the switching currents
needed by the regulator.
Ground
Circuit ground.
Output
Internal switch. The voltage at this pin switches between (+V
V
approximately V
circuitry, the PC board copper area connected to this pin should
be kept at a minimum.
Feedback (FB)
Senses the regulated output voltage to complete the feedback
loop.
ON/OFF (SD)
Allows the switching regulator circuit to be shutdown using logic
level signals thus dropping the total input supply current to
approximately 150uA. Pulling this pin below a threshold voltage
of approximately 1.3V turns the regulator on, and pulling this pin
above 1.3V (up to a maximum of 18V) shuts the regulator down.
If this shutdown feature is not needed, the ON/OFF pin can be
wired to the ground pin.
Thermal Considerations
The TO-252 surface mount package tab is designed to be
soldered to the copper on a printed circuit board. The copper
and the board are the heat sink for this package and the other
heat producing components, such as the catch diode and
inductor. The PC board copper area that the package is soldered
to should be at least 0.8 in
square inches of 2 oz. additional copper area which improves the
thermal characteristics. With copper areas greater than
approximately 6 in
are realized. If further thermal improvements are needed, double
sided, multi-layer PC board with large copper areas and/or airflow
will be recommended.
AP1507 Rev. 2
SAT
IN
) and approximately – 0.5V, with a duty cycle of
OUT
2
, only small improvements in heat dissipation
/ V
IN
. To minimize coupling to sensitive
2
, and ideally should have 2 or more
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9 of 11
IN
150KHz, 3A PWM BUCK DC/DC CONVERTER
The AP1507 (TO-252 package) junction temperature rises above
ambient temperature with a 3A load for various input and output
voltages. This data was taken with the circuit operating as a
buck-switching regulator with all components mounted on a
PC board to simulate the junction temperature under actual
operating conditions. This curve can be used for a quick check
for the approximate junction temperature for various conditions,
but there are many factors that can affect the junction
temperature.
double sided or multi-layer PC boards with large copper areas
and/or airflow might be needed, especially for high ambient
temperatures and high output voltages.
For the best thermal performance, wide copper traces and
generous amounts of printed circuit board copper should be used
in the board layout. (One exception to this is the output (switch)
pin, which should not have large areas of copper.) Large areas
of copper provide the best transfer of heat (lower thermal
resistance) to the surrounding air, and moving air lowers the
thermal resistance even further.
Package thermal resistance and junction temperature rise
numbers are all approximate, and there are many factors that will
affect these numbers. Some of these factors include board size,
shape, thickness, position, location, and even board temperature.
Other factors are trace width, total printed circuit copper area,
copper thickness, single or double-sided, multi-layer board and
the amount of solder on the board. The effectiveness of the
PC board to dissipate heat also depends on the size, quantity
and spacing of other components on the board, as well as
whether the surrounding air is still or moving. Furthermore, some
of these components such as the catch diode will add heat to the
PC board and the heat can vary as the input voltage changes.
For the inductor, depending on the physical size, type of core
material and the DC resistance, it could either act as a heat sink
taking heat away from the board, or it could add heat to the
board.
When load currents higher than 3A are used,
FEBRUARY 2008
©
AP1507
Diodes Incorporated

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