XC2VP2-5FFG672C Xilinx Inc, XC2VP2-5FFG672C Datasheet - Page 198
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XC2VP2-5FFG672C
Manufacturer Part Number
XC2VP2-5FFG672C
Description
IC FPGA VIRTEX-II PRO 672-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet
1.XC2VP20-5FGG676C.pdf
(430 pages)
Specifications of XC2VP2-5FFG672C
Number Of Logic Elements/cells
3168
Number Of Labs/clbs
352
Total Ram Bits
221184
Number Of I /o
204
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
672-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Available stocks
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XC2VP2-5FFG672C
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XILINX
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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
pitch).
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
70
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