XC3S2000-5FGG676C Xilinx Inc, XC3S2000-5FGG676C Datasheet - Page 122

• Manufacturer Part Number: XC3S2000-5FGG676C
• Description: SPARTAN-3A FPGA 2M 676-FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3r

Specifications of XC3S2000-5FGG676C

• Total Ram Bits: 737280
• Number Of Logic Elements/cells: 46080
• Number Of Labs/clbs: 5120
• Number Of I /o: 489
• Number Of Gates: 2000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• No. Of Logic Blocks: 5120
• No. Of Gates: 2000000
• No. Of Macrocells: 46080
• Family Type: Spartan-3
• No. Of Speed Grades: 5
• No. Of I/o's: 489
• Clock: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Spartan-3 FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3 FPGA is reported using either
the
grated in the Xilinx ISE development software.
vides the thermal characteristics for the various Spartan-3
package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
122
XPower
Estimator (XPE) or the XPower Analyzer inte-
JC
) indicates the
Table 85
www.xilinx.com
pro-
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
JA
value in a system without a fan. The thermal
DS099-4 (v2.5) December 4, 2009
Product Specification
JA
JB
) value
) value
JA
R