XC3S5000-4FGG900C Xilinx Inc, XC3S5000-4FGG900C Datasheet - Page 122
XC3S5000-4FGG900C
Manufacturer Part Number
XC3S5000-4FGG900C
Description
SPARTAN-3A FPGA 5M STD 900-FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3r
Datasheet
1.XC3S50-4VQG100C.pdf
(217 pages)
Specifications of XC3S5000-4FGG900C
Number Of Logic Elements/cells
74880
Number Of Labs/clbs
8320
Total Ram Bits
1916928
Number Of I /o
633
Number Of Gates
5000000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
900-BBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Spartan-3 FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3 FPGA is reported using either
the
grated in the Xilinx ISE development software.
vides the thermal characteristics for the various Spartan-3
package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
122
XPower
Estimator (XPE) or the XPower Analyzer inte-
JC
) indicates the
Table 85
www.xilinx.com
pro-
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
JA
value in a system without a fan. The thermal
DS099-4 (v2.5) December 4, 2009
Product Specification
JA
JB
) value
) value
JA
R
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