XCV300E-6BG432C Xilinx Inc, XCV300E-6BG432C Datasheet - Page 2
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XCV300E-6BG432C
Manufacturer Part Number
XCV300E-6BG432C
Description
IC FPGA 1.8V C-TEMP 432-MBGA
Manufacturer
Xilinx Inc
Series
Virtex™-Er
Datasheet
1.XCV50E-6CS144C.pdf
(6 pages)
Specifications of XCV300E-6BG432C
Number Of Logic Elements/cells
6912
Number Of Labs/clbs
1536
Total Ram Bits
131072
Number Of I /o
316
Number Of Gates
411955
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
432-LBGA, Metal
Case
BGA
Dc
05+
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XCV300E-6BG432C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Virtex™-E 1.8 V Field Programmable Gate Arrays
Table 1: Virtex-E Field-Programmable Gate Array Family Members
Virtex-E Compared to Virtex Devices
The Virtex-E family offers up to 43,200 logic cells in devices
up to 30% faster than the Virtex family.
I/O performance is increased to 622 Mb/s using Source
Synchronous data transmission architectures and synchro-
nous system performance up to 240 MHz using sin-
gled-ended SelectI/O technology. Additional I/O standards
are supported, notably LVPECL, LVDS, and BLVDS, which
use two pins per signal. Almost all signal pins can be used
for these new standards.
Virtex-E devices have up to 640 Kb of faster (250 MHz)
block SelectRAM, but the individual RAMs are the same
size and structure as in the Virtex family. They also have
eight DLLs instead of the four in Virtex devices. Each indi-
vidual DLL is slightly improved with easier clock mirroring
and 4x frequency multiplication.
V
ory, is 1.8 V, instead of 2.5 V for Virtex devices. Advanced
processing and 0.18 µm design rules have resulted in
smaller dice, faster speed, and lower power consumption.
I/O pins are 3 V tolerant, and can be 5 V tolerant with an
external 100 Ω resistor. PCI 5 V is not supported. With the
addition of appropriate external resistors, any pin can toler-
ate any voltage desired.
Banking rules are different. With Virtex devices, all input
buffers are powered by V
LVTTL, LVCMOS2, and PCI input buffers are powered by
the I/O supply voltage V
Module 1 of 4
2
CCINT
XCV1000E
XCV1600E
XCV2000E
XCV2600E
XCV3200E
XCV100E
XCV200E
XCV300E
XCV400E
XCV600E
XCV50E
Device
, the supply voltage for the internal logic and mem-
1,569,178
2,188,742
2,541,952
3,263,755
4,074,387
System
128,236
306,393
411,955
569,952
985,882
71,693
Gates
CCO
CCINT
.
. With Virtex-E devices, the
129,600
186,624
331,776
419,904
518,400
685,584
876,096
20,736
32,400
63,504
82,944
Gates
Logic
104 x 156
72 x 108
80 x 120
92 x 138
16 x 24
20 x 30
28 x 42
32 x 48
40 x 60
48 x 72
64 x 96
Array
CLB
www.xilinx.com
1-800-255-7778
10,800
15,552
27,648
34,992
43,200
57,132
73,008
Logic
1,728
2,700
5,292
6,912
Cells
The Virtex-E family is not bitstream-compatible with the Vir-
tex family, but Virtex designs can be compiled into equiva-
lent Virtex-E devices.
The same device in the same package for the Virtex-E and
Virtex families are pin-compatible with some minor excep-
tions. See the data sheet pinout section for details.
General Description
The Virtex-E FPGA family delivers high-performance,
high-capacity programmable logic solutions. Dramatic
increases in silicon efficiency result from optimizing the new
architecture for place-and-route efficiency and exploiting an
aggressive 6-layer metal 0.18 µm CMOS process. These
advances make Virtex-E FPGAs powerful and flexible alter-
natives to mask-programmed gate arrays. The Virtex-E fam-
ily includes the nine members in
Building on experience gained from Virtex FPGAs, the
Virtex-E family is an evolutionary step forward in program-
mable logic design. Combining a wide variety of program-
mable system features, a rich hierarchy of fast, flexible
interconnect resources, and advanced process technology,
the Virtex-E family delivers a high-speed and high-capacity
programmable logic solution that enhances design flexibility
while reducing time-to-market.
Virtex-E Architecture
Virtex-E devices feature a flexible, regular architecture that
comprises an array of configurable logic blocks (CLBs) sur-
rounded by programmable input/output blocks (IOBs), all
interconnected by a rich hierarchy of fast, versatile routing
Differential
I/O Pairs
119
137
183
247
281
344
344
344
344
83
83
User
176
196
284
316
404
512
660
724
804
804
804
I/O
Production Product Specification
BlockRAM
114,688
131,072
163,840
294,912
393,216
589,824
655,360
753,664
851,968
DS022-1 (v2.3) July 17, 2002
65,536
81,920
Table
Bits
1.
Distributed
RAM Bits
1,038,336
153,600
221,184
393,216
497,664
614,400
812,544
24,576
38,400
75,264
98,304
R