XCV300-5FG456C Xilinx Inc, XCV300-5FG456C Datasheet - Page 3

• Manufacturer Part Number: XCV300-5FG456C
• Description: IC FPGA 2.5V C-TEMP 456-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™r

Specifications of XCV300-5FG456C

• Number Of Logic Elements/cells: 6912
• Number Of Labs/clbs: 1536
• Total Ram Bits: 65536
• Number Of I /o: 312
• Number Of Gates: 322970
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 456-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex Device/Package Combinations and Maximum I/O
Table 3: Virtex Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
Virtex Ordering Information
DS003-1 (v2.5 ) April 2, 2001
Product Specification
Package
PQ240
HQ240
BG256
BG352
BG432
BG560
CS144
TQ144
FG256
FG456
FG676
FG680
R
XCV50
166
180
176
94
98
Example:
Device Type
Speed Grade
-4
-5
-6
XCV100
166
180
176
94
98
XCV300 -6 PQ 240 C
XCV150
Figure 1: Virtex Ordering Information
166
180
260
176
260
XCV200
www.xilinx.com
1-800-255-7778
166
180
260
176
284
Temperature Range
C = Commercial (T
I = Industrial (T
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine-pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
HQ = High Heat Dissipation QFP
TQ = Thin Quad Flat Pack
CS = Chip-scale Package
XCV300
166
260
316
312
Virtex™ 2.5 V Field Programmable Gate Arrays
XCV400
J
166
316
404
404
= –40°C to +100°C)
J
= 0°C to +85°C)
XCV600
166
316
404
444
512
XCV800
166
316
404
444
512
Module 1 of 4
XCV1000
404
512
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