XC2VP20-7FFG896C Xilinx Inc, XC2VP20-7FFG896C Datasheet - Page 198
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XC2VP20-7FFG896C
Manufacturer Part Number
XC2VP20-7FFG896C
Description
IC FPGA VIRTEX-II PRO 896-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet
1.XC2VP20-5FGG676C.pdf
(430 pages)
Specifications of XC2VP20-7FFG896C
Number Of Logic Elements/cells
20880
Number Of Labs/clbs
2320
Total Ram Bits
1622016
Number Of I /o
556
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
896-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
pitch).
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
70
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