XC2VP30-7FFG1152C Xilinx Inc, XC2VP30-7FFG1152C Datasheet - Page 380
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XC2VP30-7FFG1152C
Manufacturer Part Number
XC2VP30-7FFG1152C
Description
IC FPGA VIRTEX-II PRO 1152-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet
1.XC2VP20-5FGG676C.pdf
(430 pages)
Specifications of XC2VP30-7FFG1152C
Number Of Logic Elements/cells
30816
Number Of Labs/clbs
3424
Total Ram Bits
2506752
Number Of I /o
644
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1152-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
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Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF1704 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 9: FF1704 Flip-Chip Fine-Pitch BGA Package Specifications
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
252
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