XCV812E-7BG560C Xilinx Inc, XCV812E-7BG560C Datasheet - Page 3
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XCV812E-7BG560C
Manufacturer Part Number
XCV812E-7BG560C
Description
IC FPGA 1.8V C-TEMP 560-MBGA
Manufacturer
Xilinx Inc
Series
Virtex™-E EMr
Datasheet
1.XCV405E-6FG676C.pdf
(118 pages)
Specifications of XCV812E-7BG560C
Number Of Logic Elements/cells
21168
Number Of Labs/clbs
4704
Total Ram Bits
1146880
Number Of I /o
404
Number Of Gates
254016
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
560-LBGA, Metal
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XCV812E-7BG560C
Manufacturer:
OMRON
Quantity:
1 001
Company:
Part Number:
XCV812E-7BG560C
Manufacturer:
XilinxInc
Quantity:
3 000
Table 2: Performance for Common Circuit Functions
Virtex-E Extended Memory Device/Package Combinations and Maximum I/O
Table 3: Virtex-EM Family Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
Virtex-E Extended Memory Ordering Information
DS025-1 (v1.5) July 17, 2002
Production Product Specification
Register-to-Register
Adder
Pipelined Multiplier
Address Decoder
16:1 Multiplexer
Parity Tree
Chip-to-Chip
HSTL Class IV
LVTTL,16mA, fast slew
LVDS
LVPECL
R
Package
BG560
FG676
FG900
Function
Example: XCV405E-6BG560C
Device Type
Speed Grade
(-6, -7, -8)
Figure 1: Virtex Ordering Information
Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
www.xilinx.com
1-800-255-7778
XCV405E
16 x 16
8 x 8
Bits
404
404
16
64
16
64
18
36
9
Temperature Range
C = Commercial (T
I = Industrial (T
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
J
= −40˚C to +100˚C)
J
= 0˚C to +85˚C)
DS025_001_112000
Virtex-E -7
4.3 ns
6.3 ns
4.4 ns
5.1 ns
3.8 ns
5.5 ns
4.6 ns
3.5 ns
4.3 ns
5.9 ns
XCV812E
404
556
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