CY8C20636A-24LTXI Cypress Semiconductor Corp, CY8C20636A-24LTXI Datasheet - Page 34
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CY8C20636A-24LTXI
Manufacturer Part Number
CY8C20636A-24LTXI
Description
MCU 8K FLASH 1K SRAM 48VQFN
Manufacturer
Cypress Semiconductor Corp
Series
CapSense® Controllersr
Specifications of CY8C20636A-24LTXI
Program Memory Type
FLASH (8 kB)
Package / Case
48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
Applications
Capacitive Sensing
Core Processor
M8C
Controller Series
CY8C20xx6A
Ram Size
1K x 8
Interface
I²C, SPI
Number Of I /o
36
Voltage - Supply
1.71 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Processor Series
CY8C20x36A
Core
M8C
Data Ram Size
1 KB
Interface Type
I2C, SPI
Maximum Clock Frequency
400 KHz
Number Of Programmable I/os
36
Number Of Timers
3
Operating Supply Voltage
1.71 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
CY3280-20X66
Minimum Operating Temperature
- 40 C
Program Memory Size
8 KB
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Application
CapSense
Processing Unit
Microprocessor
Operating Supply Voltage (min)
1.71V
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Package Type
QFN EP
Pin Count
48
Mounting
Surface Mount
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1000 - ISP 4PORT FOR CYPRESS PSOC MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY8C20636A-24LTXI
Manufacturer:
CY
Quantity:
110
Part Number:
CY8C20636A-24LTXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Thermal Impedances
Table 36. Thermal Impedances per Package
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 37. Solder Reflow Peak Temperature
Document Number: 001-54459 Rev. **
Notes
12. T
13. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
14. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
24 QFN
32 QFN
48 QFN
48 SSOP
Package
48 SSOP
Package
16 QFN
24 QFN
32 QFN
48 QFN
16 QFN
JA
.
[13]
[13]
[13]
Minimum Peak Temperature
Typical θ
32.69
20.90
19.51
17.68
69
240
240
240
220
240
o
C/W
o
o
o
o
o
o
o
o
o
C
C
C
C
C
C/W
C/W
C/W
C/W
JA
[12]
[14]
CY8C20X36A/46A/66A/96A
Maximum Peak Temperature
o
C with Sn-Pb or 245 ± 5
260
260
260
260
260
o
o
o
o
o
C
C
C
C
C
o
C with Sn-Ag-Cu paste.
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