PIC10F200-I/P Microchip Technology, PIC10F200-I/P Datasheet - Page 4

• Manufacturer Part Number: PIC10F200-I/P
• Description: IC PIC MCU FLASH 256X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F200-I/P

• Program Memory Type: FLASH
• Program Memory Size: 384B (256 x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINAC164037 - MODULE SKT 6L PROMATE II SOT23
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC10F200/202/204/206
APPENDIX A:
Rev A Document (6/2004)
First revision of this document.
Rev B Document (6/2004)
Added Module 2, V
Rev C Document (9/2004)
Added Module 3, MPLAB IDE and the _CONFIG
assembly directive.
Rev D Document (6/2006)
Added the following Modules to the “Clarifications/
Corrections to the Data Sheet” section:
• Module 1,
• Module 2, “Voltage Reference”
• Module 3, “8-Lead 2x3 DFN (MC) Packaging”
• Module 4, “8-Lead 2x3 DFN (MC) Package – Top
• Module 5, “6-Lead SOT-23 (OT) Package – Top
Rev E Document (3/2007)
Revised Module 1 and Module 2 work arounds.
Clarification/Corrections to the Data Sheet:
Revised Module 3: Replaced DFN Package Drawing;
Added Module 6, “Timer0 Clock”;
Added Module 7, Special Features of the CPU,
Register 9-1.
Rev F Document (5/2007)
Revised Module 3, Table 1, Note 1.
Clarification/Corrections to the Data Sheet:
Data Sheet was updated. The following was removed:
• Module 1,
• Module 2, “Voltage Reference”
• Module 3, “8-Lead 2x3 DFN (MC) Packaging”
• Module 4, “8-Lead 2x3 DFN (MC) Package – Top
• Module 5, “6-Lead SOT-23 (OT) Package – Top
• Module 6, “Timer0 Clock”;
Module 7, Special Features of the CPU, Register 9-1 is
renumbered to Module 1.
Rev G Document (6/2007)
Moved Module 3 to Module 4.
Added Module 3: I
DS80194G-page 4
Marking”
Marking”
Marking”
Marking”
“
“
Internal Oscillator”
Internal Oscillator”
PD
REF
, Power-Down Base current
REVISION HISTORY
is disabled in Sleep.
© 2007 Microchip Technology Inc.