PIC10F220-I/MC Microchip Technology, PIC10F220-I/MC Datasheet - Page 79

• Manufacturer Part Number: PIC10F220-I/MC
• Description: IC PIC MCU FLASH 256X12 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F220-I/MC

• Core Size: 8-Bit
• Program Memory Size: 384B (256 x 12)
• Core Processor: PIC
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Program Memory Type: FLASH
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC10
• No. Of I/o's: 4
• Ram Memory Size: 16Byte
• Cpu Speed: 8MHz
• No. Of Timers: 1
• Digital Ic Case Style: DFN
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 2 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163020-2 - ADAPTER PROGRAM PIC10F 2X3 DFNAC162070 - HEADER INTRFC MPLAB ICD2 8/14P
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
MIN
1.30
1.50
0.18
0.30
0.20
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
PIC10F220/222
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
0.50
1.75
1.90
0.30
–
E2
NOTE 1
DS41270E-page 77