PIC12F508-I/P Microchip Technology, PIC12F508-I/P Datasheet - Page 99
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PIC12F508-I/P
Manufacturer Part Number
PIC12F508-I/P
Description
IC MCU FLASH 512X12 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F509T-ISN.pdf
(110 pages)
2.PIC12F509T-ISN.pdf
(4 pages)
3.PIC12F509T-ISN.pdf
(20 pages)
4.PIC12F509-EMC.pdf
(106 pages)
Specifications of PIC12F508-I/P
Program Memory Type
FLASH
Program Memory Size
768B (512 x 12)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Ram Size
25 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
25 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
6
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164101, DM163014, DV164120, DM163029
Minimum Operating Temperature
- 40 C
Package
8PDIP
Device Core
PIC
Family Name
PIC12
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F508-I/P
Manufacturer:
Grayhill
Quantity:
101
Part Number:
PIC12F508-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F508/509/16F505
APPENDIX A:
REVISION HISTORY
Revision A (April 2004)
Original
data
sheet
for
PIC12F508/509/16F505
devices
Revision B (June 2005)
Update packages
Revision C (03/2007)
Revised Table 3-2 Legend; Revised Table 3-3 RB3 and
Legend; Revised Table 10-4 F10; Replaced Package
Drawings (Rev. AN); Added DFN package; Replaced
Development Support Section; Revised Product ID
System.
Revision D (12/2007)
Revised Title; Operating Current; Table 1-1 added DFN
and revised note; Revised Section 3.0, last paragraph;
Revised Figure 4-4; Revised Table 4-2 (FSR); Revised
Register 7-1 and Register 7-2; Revised Section 7.2.2;
Revised Table 7-3, Note 2; Revised Table 7-4 (FSR)
and Note 2; Deleted Section 7.3.1: External Clock In
and Figure 7-6; Revised new Section 7.3.1; Replaced
TBD with new data in Tables 10-4 and 10-5; Revised
Tables 10-1 (Industrial), 10-2 (Extended), and Tables
10-1 (Industrial, Extended) and 10-2 (Pull-up Resistor
Ranges), 10-3, 10-4 and 10-6; Revised Figure 10-1,
Figure 10-2; Section 11.0, Added Char data; Revised
Package Marking Information; Revised Product ID
System.
Preliminary
© 2007 Microchip Technology Inc.
DS41236D-page 97