APF30-30-13CB CTS, APF30-30-13CB Datasheet - Page 18
![Heatsinks 30x30x13mm](/photos/32/60/326079/apf_sml.jpg)
APF30-30-13CB
Manufacturer Part Number
APF30-30-13CB
Description
Heatsinks 30x30x13mm
Manufacturer
CTS
Datasheet
1.Z3A45SBSBNR.pdf
(24 pages)
Specifications of APF30-30-13CB
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Black Anodized
Fin Style
Horizontal
Thermal Resistance
2.45 C / W
Dimensions
30 mm L x 30 mm W x 12.7 mm H
Designed For
BGA, PGA, PLCC, QFP
Color
Black
CTS
iZIF
GENERAL DESCRIPTION
the PCB retainer for improved structural integrity and thermal
efficiency (.8°C-in./W). The iZIF
pending design for rugged military and aerospace circuit card
applications. It features a quarter-turn lock, uniform clamping
pressure, and can be sized to fit small daughter cards up to
9U VME. A bottom plate may also be added for additional
cooling and structural integrity. The iZIF
stainless steel socket head cap rod with beryllium copper
spring. A variety of finishes are available such as chemical
film, black anodize, and electroless nickel.
THERMAL LINKS
GENERAL DESCRIPTION
of the 6 to 8-segment fingers versus the 2 or 3-segment
fingers available from other manufacturers. These thermal
links are offered for TO-5s, TO-8s and TO-18s with or
without BeO washer and other appropriate hardware.
path between semiconductor and heat sinks or chassis.
FAN TOP SERIES
18
They provide an effective retainer and efficient thermal
CTS’s thermal links provide superior retention because
The iZIF
™
HEAT FRAME
®
™
is a custom aluminum heat frame that integrates
Fan Tops
*Natural convection, case-ambient mounted on G10 board
Dim.
“A”
.25
.25
.25
.25
.36
.33
.12
.12
1.25
1.25
1.25
1.25
Dim.
“B”
.50
.50
.75
.75
Semiconductor
Case Type
TO-18
TO-18
TO-5
TO-5
TO-5
TO-8
TO-5
TO-8
™
is a highly reliable patent-
*Ø °C/W
150.0
150.0
81.1
81.1
57.7
41.0
56.6
56.6
™
features a 1/8”
TXBF2-032-036U TXBF2-032-036B
TXBF2-050-033U TXBF2-050-033B
TXBF-019-025U
TXCF-019-025U
TXBF-032-025U
TXCF-032-025U
TXCF-125-1U
TXCF-125-2U
Unplated
vibration and shock loads. The thermal links can be
inserted and removed multiple times without loss of
retention or damage to the finish over the entire JEDEC
case diameter range. They can be installed with a rivet or
eyelet, soldered to a PC pad or heat sink, mounted with a
single screw or with a threaded stud and hex nut.
Black Cadmium
Part Number
TXBF-019-025B
TXBF-032-025B
TXCF-125-1CB
TXCF-125-2B
There is excellent transistor retention under high
N.A.
N.A.
B
A
TXCF-019-025CB
TXCF-032-025CB
Black Chem.
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
BeCu Retainer
BeCu Retainer
Brass Fan
Brass Fan
Material
Brass
Brass
Brass
Brass
BeCu
BeCu