APF30-30-10CB CTS, APF30-30-10CB Datasheet - Page 9

• Manufacturer Part Number: APF30-30-10CB
• Description: Heatsinks 30x30x10mm
• Manufacturer: CTS

Specifications of APF30-30-10CB

• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Black Anodized
• Fin Style: Horizontal
• Thermal Resistance: 3.25 C /W
• Dimensions: 30 mm L x 30 mm W x 9.5 mm H
• Designed For: BGA, PGA, PLCC, QFP
• Color: Black

STANDARD AND CUSTOM EXTRUSIONS
and manufacturing custom products for your unique
design. Our extruded heat sinks are designed for high
power semiconductors and are ideal where cost is a
factor. We provide special assistance with engineering,
manufacturing and expedited deliveries to meet your
specific requirements.
custom designs. Modified profiles can be tooled quickly
and cost-effectively. Below are just a few of the many
profiles available. Please contact CTS for additional
information.
CUSTOM EXTRUDED PRODUCTS AND STANDARD PROFILES
CTS specializes in using standard extrusion profiles
CTS maintains a large inventory of extrusions for
CTS
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