610-40AB Wakefield Thermal Solutions, 610-40AB Datasheet - Page 9

Heatsinks 31.5mm SQ 10.2mm FIN

610-40AB

Manufacturer Part Number
610-40AB
Description
Heatsinks 31.5mm SQ 10.2mm FIN
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of 610-40AB

Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Aluminum
Dimensions
31.5 mm L x 31.5 mm W x 10.2 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Color
Black
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500

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