FBR46ND005-P Fujitsu, FBR46ND005-P Datasheet - Page 7

Low Signal Relays - PCB Mini Signal 5VDC

FBR46ND005-P

Manufacturer Part Number
FBR46ND005-P
Description
Low Signal Relays - PCB Mini Signal 5VDC
Manufacturer
Fujitsu
Datasheet

Specifications of FBR46ND005-P

Contact Form
2 Form C (DPDT)
Coil Voltage
5 VDC
Coil Type
Non-Latching
Power Consumption
150 mW
Termination Style
PCB Pins
Maximum Switching Current
1 A
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
RoHS Compliance and Lead Free Relay Information
1. General Information
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Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Profile
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Reflow Solder condition
3. Moisture Sensitivity
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4. Tin Whisker
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Relays produced after the specific date code that is indicated on each data sheet are lead-free
To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
“LF” is marked on each outer and inner carton. (No marking on individual relays).
We will ship leaded relays as long as the leaded relay inventory exists.
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.
All signal and most power relays also comply with RoHS. Please refer to individual data
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
Recommended solder paste Sn-3.0Ag-0.5Cu.
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in
house test.
We highly recommend that you confirm your actual solder conditions
maximum 120˚C
dip within 5 sec. at
260˚C soler bath
maximum 3 sec.
FBR46 SERIES
7

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