A80960KB25 Intel, A80960KB25 Datasheet - Page 35

• Manufacturer Part Number: A80960KB25
• Description: IC MPU I960KB 25MHZ 132-PGA
• Manufacturer: Intel

Specifications of A80960KB25

• Processor Type: i960
• Features: KB suffix, 32-Bit, 512 Byte Cache
• Speed: 25MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 132-PGA
• Family Name: i960
• Device Core Size: 32b
• Frequency (max): 25MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 5V
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (min): 4.75V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 132
• Package Type: PGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 803535

3.3
The 80960KB is specified for operation when case
temperature is within the range 0°C to 85°C (PGA)
or 0°C to 100°C (PQFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
•
•
•
Values for θ
Table 12 for the PGA package and in Table 12 for
the PQFP package. The PGA’s θ
by adding a heatsink. For the PQFP, however, a
heatsink is not generally used since the device is
intended to be surface mounted.
Maximum allowable ambient temperature (T
permitted without exceeding T
graphs in Figures 23, 24, 25 and 26. The curves
assume the maximum permitted supply current (I
at each speed, V
(PGA) or +100°C (PQFP).
NOTES:
1. This table applies to 80960KB PGA plugged into socket or soldered directly to board.
2. θ
3. θ
(Unidirectional Heat-
θ Junction-to-Case
θ Case-to-Ambient
θ Case-to-Ambient
θ Case-to-Ambient
(Omnidirectional
θ
θ
(No Heatsink)
Parameter
JA
J-CAP
J-PIN
J-PIN
T
T
T
A
Heatsink)
J
C
= θ
Package Thermal Specification
= T
= T
= T
sink)
= 4°C/W (inner pins) (approx.)
= 8°C/W (outer pins) (approx.)
= 4°C/W (approx.)
JC
C
J
A
ja
+ θ
+ P*θ
+ P*θ
+ P*[θ
and θ
CA
CC
ja
jc
jc
ja
of +5.0 V and a T
−θ
for various airflows are given in
jc
(0)
19
16
15
Thermal Resistance — °C/Watt
0
2
]
Table 14. 80960KB PGA Package Thermal Characteristics
(0.25)
C
50
18
15
14
2
ja
is shown by the
can be reduced
Airflow — ft./min (m/sec)
CASE
(0.50)
100
17
14
13
2
of +85°C
(1.01)
CC
200
15
12
11
A
2
)
)
(2.03)
If the 80960KB is to be used in a harsh environment
where the ambient temperature may exceed the
limits for the normal commercial part, consider using
an
components are available at 16, 20 and 25 MHz in
the ceramic PGA package. Extended operating
temperature range is –40° C to +125°C (case).
Figure 26 shows the maximum allowable ambient
temperature for the 20 MHz extended temperature
TA80960KB at various airflows. The curve assumes
an I
+125°C.
400
12
2
9
8
CC
extended
(3.04)
of 420 mA, V
600
10
2
7
6
(4.06)
800
2
9
6
5
temperature
CC
θ
of 5.0 V and a T
J-PIN
θ
JA
device.
θ
JC
80960KB
CASE
θ
These
J-CAP
29
of