MAX1617AMEE-T Maxim Integrated Products, MAX1617AMEE-T Datasheet - Page 8

• Manufacturer Part Number: MAX1617AMEE-T
• Description: Board Mount Temperature Sensors
• Manufacturer: Maxim Integrated Products

Specifications of MAX1617AMEE-T

• Full Temp Accuracy: +/- 3 C
• Package / Case: QSOP-16
• Digital Output - Bus Interface: Serial (2-Wire)
• Digital Output - Number Of Bits: 7 bit + Sign
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Output Type: Digital
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Excess resistance in series with the remote diode caus-
es about +1/2°C error per ohm. Likewise, 200µV of off-
set voltage forced on DXP–DXN causes about 1°C error.
If a Start command is written (or generated automatical-
ly in the free-running auto-convert mode), both channels
are converted, and the results of both measurements
are available after the end of conversion. A BUSY status
bit in the status byte shows that the device is actually
performing a new conversion; however, even if the ADC
is busy, the results of the previous conversion are
always available.
Temperature accuracy depends on having a good-qual-
ity, diode-connected small-signal transistor. Accuracy
has been experimentally verified for all of the devices
listed in Table 1. The MAX1617A can also directly mea-
sure the die temperature of CPUs and other integrated
circuits having on-board temperature-sensing diodes.
The transistor must be a small-signal type with a rela-
tively high forward voltage; otherwise, the A/D input
voltage range can be violated. The forward voltage
must be greater than 0.25V at 10µA; check to ensure
this is true at the highest expected temperature. The
forward voltage must be less than 0.95V at 100µA;
check to ensure this is true at the lowest expected tem-
perature. Large power transistors don’t work at all. Also
ensure that the base resistance is less than 100Ω. Tight
specifications for forward-current gain (+50 to +150, for
example) indicate that the manufacturer has good
process controls and that the devices have consistent
VBE characteristics.
For heatsink mounting, the 500-32BT02-000 thermal
sensor from Fenwal Electronics is a good choice. This
device consists of a diode-connected transistor, an
aluminum plate with screw hole, and twisted-pair cable
(Fenwal Inc., Milford, MA, 508-478-6000).
Thermal mass can seriously degrade the MAX1617A’s
effective accuracy. The thermal time constant of the
QSOP-16 package is about 140sec in still air. For the
MAX1617A junction temperature to settle to within +1°C
after a sudden +100°C change requires about five time
constants or 12 minutes. The use of smaller packages
for remote sensors, such as SOT23s, improves the situ-
ation. Take care to account for thermal gradients
between the heat source and the sensor, and ensure
that stray air currents across the sensor package do
not interfere with measurement accuracy.
Remote/Local Temperature Sensor
with SMBus Serial Interface
8
_______________________________________________________________________________________
Thermal Mass and Self-Heating
A/D Conversion Sequence
Remote-Diode Selection
Self-heating does not significantly affect measurement
accuracy. Remote-sensor self-heating due to the diode
current source is negligible. For the local diode, the
worst-case error occurs when auto-converting at the
fastest rate and simultaneously sinking maximum cur-
rent at the ALERT output. For example, at an 8Hz rate
and with ALERT sinking 1mA, the typical power dissi-
pation is V
J-A is about 150°C/W, so with V
PC board heatsinking, the resulting temperature rise is:
Even with these contrived circumstances, it is difficult
to introduce significant self-heating errors.
The ADC is an integrating type with inherently good
noise rejection, especially of low-frequency signals
such as 60Hz/120Hz power-supply hum. Micropower
operation places constraints on high-frequency noise
rejection; therefore, careful PC board layout and proper
external noise filtering are required for high-accuracy
remote measurements in electrically noisy environ-
ments.
High-frequency EMI is best filtered at DXP and DXN
with an external 2200pF capacitor. This value can be
increased to about 3300pF (max), including cable
capacitance. Higher capacitance than 3300pF intro-
duces errors due to the rise time of the switched cur-
rent source.
Nearly all noise sources tested cause the ADC measure-
ments to be higher than the actual temperature, typically
by +1°C to +10°C, depending on the frequency and
amplitude (see Typical Operating Characteristics ).
Table 1. Remote-Sensor Transistor
Manufacturers
Note: Transistors must be diode-connected (base shorted to
collector).
Central Semiconductor (USA)
Motorola (USA)
National Semiconductor (USA)
Rohm Semiconductor (Japan)
Samsung (Korea)
Siemens (Germany)
Zetex (England)
MANUFACTURER
CC
dT = 2.7mW · 150°C/W = 0.4°C
· 450µA plus 0.4V · 1mA. Package theta
ADC Noise Filtering
CC
CMPT3904
MMBT3904
MMBT3904
SST3904
KST3904-TF
SMBT3904
FMMT3904CT-ND
= 5V and no copper
MODEL NUMBER
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