PKB4204BPI Ericsson Power Modules, PKB4204BPI Datasheet - Page 21

• Manufacturer Part Number: PKB4204BPI
• Description: DC/DC Converters & Regulators 240W 36-75Vin/12Vout 1/8-BRICK
• Manufacturer: Ericsson Power Modules
• Series: PKB-Br

Specifications of PKB4204BPI

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

E
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb and Pb-free
processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
of the solder melting temperature, (T
for more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of
solder paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be
used, if the products are kept in a controlled environment (dry
pack handling and storage) prior to assembly.
Prepared (also subject responsible if other)
EXXUYNG
Approved
SEC/D (Betty Wu)
General reflow process specifications
Average ramp-up (T
Typical solder melting (liquidus)
temperature
Minimum reflow time above T
Minimum pin temperature
Peak product temperature
Average ramp-down (T
Maximum time 25°C to peak
PKB 4000B series Intermediate Bus Converters
Input 36-75 V, Output up to 40 A / 252 W
Temperature
T
L
T
PIN
minimum
PRODUCT
PRODUCT
Time in preheat
)
T
/ soak zone
PRODUCT
Time 25°C to peak
)
L
T
T
T
maximum
L
PIN
PRODUCT
SnPb eutectic
3°C/s max
183°C
30 s
210°C
225°C
6°C/s max
6 minutes
L
, 183°C for Sn63Pb37)
Time in
reflow
Checked
See §1
PIN
profile
Pb-free
3°C/s max
221°C
30 s
235°C
260°C
6°C/s max
8 minutes
Pin
) in excess
Product
profile
Time
Ericsson Confidential
PRODUCT SPEC.
No.
5/1301- BMR 658 Uen
Date
2008-11-27
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handling, packing, shipping
and use of moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Thermocouple Attachment
Top of PCB near pin 2 for measurement of
maximum product temperature, T
PRODUCT
Pin 4 for measurement of minimum pin (solder
joint) temperature, T
) since this will likely be the warmest part of the
PRODUCT
PRODUCT
Technical Specification
EN/LZT 146 384 R3C January 2010
© Ericsson AB
Rev
B
must not exceed 225 °C at any time.
must not exceed 260 °C at any time.
PIN
Reference
PRODUCT
L
, 217 to 221°C for
PIN
) in
1 (4)
21