VNC2-64L1B-TRAY FTDI, Future Technology Devices International Ltd, VNC2-64L1B-TRAY Datasheet - Page 85
![IC USB HOST VINCULUM-II 64LQFP](/photos/6/82/68259/ftdi_vinculum_vnc2_sml.jpg)
VNC2-64L1B-TRAY
Manufacturer Part Number
VNC2-64L1B-TRAY
Description
IC USB HOST VINCULUM-II 64LQFP
Manufacturer
FTDI, Future Technology Devices International Ltd
Series
Vinculum-IIr
Datasheet
1.VNC2-32Q1B-REEL.pdf
(90 pages)
Specifications of VNC2-64L1B-TRAY
Mfg Application Notes
Vinculum-II IO Cell Description AppNote Vinculum-II Debug Interface Description AppNote Vinculum-II IO Mux Explained AppNote Vinculum-II PWM Example AppNote Migrating Vinculum Designs AppNote
Controller Type
USB 2.0 Controller
Interface
SPI Serial, USB, UART
Voltage - Supply
1.62 V ~ 1.98 V
Current - Supply
25mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
VNC2-64L1A-TRAY
VNC2-64L1A-TRAY
VNC2-64L1A-TRAY
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
VNC2-64L1B-TRAY
Manufacturer:
FTDI, Future Technology Devices International Ltd
Quantity:
10 000
Table 38 Reflow Profile Parameter Values
Table 39 Package Reflow Peak Temperature
SnPb Eutectic and Pb free (non green material)
Pb Free (green material) = 260 +5/-0 deg C
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Package Thickness
Profile Feature
Ramp Down Rate
- Time (t
≥
< 2.5 mm
Preheat
s
Copyright © 2010 Future Technology Devices International Limited
2.5 mm
Min to t
(t
T
L
p
:
)
L
)
s
VINCULUM-II EMBEDDED DUAL USB HOST CONTROLLER IC Datasheet
Max)
s
s
L
)
Min.)
Max.)
s
p
)
to T
p
)
p
Pb Free Solder Process
Volume mm3 < 350
(green material)
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
235 +5/-0 deg C
220 +5/-0 deg C
30 to 40 seconds
8 minutes Max.
150°C
200°C
217°C
260°C
SnPb Eutectic and Pb free (non
green material) Solder Process
Document No.: FT_000138
Clearance No.: FTDI#
Volume mm3 >=350
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
220 +5/-0 deg C
220 +5/-0 deg C
20 to 40 seconds
6 minutes Max.
see Table 39
100°C
150°C
183°C
Version -
143
1.2
85