MAX5976AETE+ Maxim Integrated Products, MAX5976AETE+ Datasheet - Page 2

• Manufacturer Part Number: MAX5976AETE+
• Description: Hot Swap & Power Distribution 2.7-18V Hot-Swap Controller
• Manufacturer: Maxim Integrated Products

Specifications of MAX5976AETE+

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Note 1: As per JEDEC51 standard (multilayer board).
TQFN
Junction-to-Case Thermal Resistance (B
Junction-to-Ambient Thermal Resistance (B
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
2.7V to 18V, 7A, Hot-Swap Solution
ABSOLUTE MAXIMUM RATINGS
IN to GND ..............................................................-0.3V to +20V
CB to GND ..............................................-0.3V to (V
ON1, REG to GND ..................................................-0.3V to +6V
OUT, ON2, PRESDET
PG, FAULT to GND ...............................................-0.3V to +26V
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
ELECTRICAL CHARACTERISTICS
(V
at T
2
Input Supply Voltage Range
Input Supply Current
Default Undervoltage Lockout
Default Undervoltage Lockout
Hysteresis
ON1 Turn-On Threshold
ON1 Turn-On Threshold
Hysteresis
ON1 Input Bias Current
CURRENT LIMIT
Circuit-Breaker Accuracy
(At Startup)
Slow-Comparator Response
Time (Note 4)
MOSFET
Total On-Resistance
LOGIC INPUTS (ON2, PRESDET)
Low Voltage Input
High Voltage Input
Input Current
IN
to GND ............... -0.3V to the lower of (V
TQFN (derate 33.3mW/NC above +70NC) (Note 1) ..2666.7mW
A
= 12V, V
= +25NC.) (Note 3)
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
ON1
= 2V, V
ON2
= V
A
PRESDET
= +70NC)
V
V
SYMBOL
V
UVLO_HYS
ON1_HYS
V
I
ON1_TH
CB,TH
JC
I
t
R
UVLO
V
ON1
SCD
V
V
I
I
IN
ON
IN
IN
IH
IL
IN
) ...................30NC/W
= 0V, R
JA
+ 0.3V) and +20V
) ............... ...2NC/W
CB
REG
V
threshold
V
V
V
V
R
R
R
R
0.6% overcurrent
30% overcurrent
2.7V < V
2.7V < V
V
ON1
IN
ON1
ON1
ON1
ON2
CB
CB
CB
CB
= 40kI, T
rising, V
+ 0.3V)
= 40kI
= 28.57kI
= 20kI
= 10kI
, V
= 3V, no load, 7A current-limit
rising
falling
= 0 to 5V
PRESDET
IN
IN
< 18V
< 18V
ON1
A
CONDITIONS
= T
= V
= 0 to 6V
Operating Ambient Temperature Range ........... -40NC to +85NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -60NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
J
= -40NC to +85NC, unless otherwise noted. Typical values are
IN
2.7
1.575
2.35
1.17
3.15
MIN
6.3
4.5
1.4
15
-1
-1
TYP
1.21
1.75
200
2.5
0.1
0.1
3.5
2.7
24
5
7
5
1.925
MAX
2.65
1.25
3.85
7.5
7.7
5.5
0.4
+1
+1
18
41
UNITS
mI
mA
ms
FA
FA
Fs
V
V
V
V
V
A
V
V