DS32KHZN/WBGA Dallas Semiconductor, DS32KHZN/WBGA Datasheet - Page 4

• Manufacturer Part Number: DS32KHZN/WBGA
• Description: Oscillator, Crystal; 36 BGA; -40 degC; degC
• Manufacturer: Dallas Semiconductor
• Type: Temperature Compensated, Crystalr

Specifications of DS32KHZN/WBGA

• Frequency: 32.768 kHz
• Frequency Stability: ±7.5 ppm
• Output Load: 15 pF
• Output Type: CMOS
• Package Type: 36 BGA Pin
• Series Code: DS32KHZ-N
• Temperature, Junction, Maximum: +85 °C
• Temperature, Junction, Minimum: -40 °C
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Supply: 5 V

RELATED APPLICATION NOTES
Application Note 58: Crystal Considerations with Dallas Real-Time Clocks
Application Note 701: Using the DS32kHz with Dallas RTCs
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions
should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent
damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow
temperature (≥ 220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow
profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that
the internal crystal is not exposed to temperatures above +150°C.
Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
THERMAL INFORMATION
PACKAGE INFORMATION
16-pin SO (300 mils)
PACKAGE TYPE
14-pin Encapsulated DIP
36-pin BGA
16-pin SO (300 mils)
PACKAGE TYPE
36-pin BGA
THETA-J
(°C/W)
43.9
73
A
DOCUMENT NO.
56-G0001-002
56-G4009-001
56-G6023-001
THETA-J
(°C/W)
18.4
23
8 of 8
C