93LC66/SN Microchip Technology Inc., 93LC66/SN Datasheet - Page 4

• Manufacturer Part Number: 93LC66/SN
• Description: 4K, 512 X 8 OR 256 X 16, SER EE
• Manufacturer: Microchip Technology Inc.

Specifications of 93LC66/SN

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±10 μA
• Current, Operating: 100 μA (Read), 3 mA (Write)
• Current, Output, Leakage: ±10
• Data Retention: >200 yrs.
• Density: 4K
• Interface: 3-Wire
• Memory Type: Serial EEPROM
• Organization: 512×8/256×16
• Package Type: SOIC
• Temperature, Operating: -40 to +125 °C
• Time, Access: 500 ns
• Time, Address Setup: 50
• Voltage, Esd: ≥4 kV
• Voltage, Input, High: 3.5 V
• Voltage, Input, Low: 0.8, 0.5 V
• Voltage, Output, High: 2.3 V
• Voltage, Output, Low: 0.3 V
• Voltage, Supply: 2.5 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
 2004 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45×
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
f
MIN
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
f
INCHES*
NOM
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
8
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
4.80
0.25
0.48
0.20
0.33
3.71
93LC46/56/66
0
0
0
MILLIMETERS
NOM
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
8
4
MAX
DS21712B-page 13
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8