IRFP450PBF Vishay PCS, IRFP450PBF Datasheet - Page 2
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IRFP450PBF
Manufacturer Part Number
IRFP450PBF
Description
MOSFET, Power; N-Ch; VDSS 500V; RDS(ON) 0.4Ohm; ID 14A; TO-247AC; PD 190W; VGS +/-20V
Manufacturer
Vishay PCS
Datasheet
1.IRFP450PBF.pdf
(8 pages)
Specifications of IRFP450PBF
Current, Drain
14 A
Gate Charge, Total
150 nC
Package Type
TO-247AC
Polarization
N-Channel
Power Dissipation
190 W
Resistance, Drain To Source On
0.4 Ohm
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
92 ns
Time, Turn-on Delay
17 ns
Transconductance, Forward
9.3 S
Voltage, Breakdown, Drain To Source
500 V
Voltage, Forward, Diode
1.4 V
Voltage, Gate To Source
±20 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRFP450PBF
Manufacturer:
VISHAY
Quantity:
1 175
Company:
Part Number:
IRFP450PBF
Manufacturer:
IR
Quantity:
2 000
Part Number:
IRFP450PBF
Manufacturer:
IR
Quantity:
20 000
IRFP450, SiHFP450
Vishay Siliconix
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
www.vishay.com
2
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Case-to-Sink, Flat, Greased Surface
Maximum Junction-to-Case (Drain)
SPECIFICATIONS T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
J
a
= 25 °C, unless otherwise noted
SYMBOL
SYMBOL
ΔV
R
V
R
R
t
t
R
I
I
C
V
DS(on)
C
C
V
GS(th)
Q
Q
d(on)
d(off)
I
GSS
DSS
Q
Q
DS
g
L
L
t
I
SM
t
thCS
thJA
thJC
oss
t
t
on
DS
SD
iss
rss
S
rr
fs
gs
gd
D
r
f
S
rr
g
/T
J
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
T
V
V
V
J
R
DS
GS
GS
T
= 25 °C, I
Intrinsic turn-on time is negligible (turn-on is dominated by L
G
Reference to 25 °C, I
J
= 6.2 Ω, R
= 400 V, V
= 10 V
= 10 V
= 25 °C, I
V
V
V
V
V
f = 1.0 MHz, see fig. 5
TYP.
0.24
TEST CONDITIONS
DS
DD
DS
GS
DS
-
-
= 500 V, V
= V
= 50 V, I
= 250 V, I
F
= 0 V, I
V
V
= 14 A, dI/dt = 100 A/µs
V
GS
DS
S
GS
GS
D
GS
I
= 14 A, V
= ± 20 V
= 17 Ω, see fig. 10
D
= 25 V,
, I
= 0 V,
= 0 V, T
= 14 A, V
D
D
see fig. 6 and 13
D
= 250 µA
= 250 µA
D
GS
= 8.4 A
I
= 14 A,
D
D
= 0 V
= 8.4 A
GS
= 1 mA
J
G
G
= 125 °C
DS
= 0 V
b
= 400 V,
b
MAX.
D
S
b
0.65
D
S
b
40
b
-
b
MIN.
500
2.0
9.3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S-81271-Rev. A, 16-Jun-08
Document Number: 91233
TYP.
2600
0.63
720
340
540
5.0
4.8
17
47
92
44
13
-
-
-
-
-
-
-
-
-
-
-
-
-
UNIT
°C/W
MAX.
± 100
0.40
S
250
150
810
4.0
1.4
7.2
25
20
80
14
56
-
-
-
-
-
-
-
-
-
-
-
-
and L
D
UNIT
V/°C
)
nA
µA
nC
nH
µC
pF
ns
ns
Ω
V
V
S
A
V