MCP2022-330E/SL Microchip Technology, MCP2022-330E/SL Datasheet - Page 29
![IC LIN TXRX 3.3V 50MA 14-SOIC](/photos/6/59/65933/150-14-soic_sml.jpg)
MCP2022-330E/SL
Manufacturer Part Number
MCP2022-330E/SL
Description
IC LIN TXRX 3.3V 50MA 14-SOIC
Manufacturer
Microchip Technology
Type
Transceiverr
Specifications of MCP2022-330E/SL
Number Of Drivers/receivers
1/1
Protocol
LIN
Voltage - Supply
6 V ~ 18 V
Mounting Type
Surface Mount
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Data Rate
20Kbps
Supply Voltage Range
6V To 18V
Logic Case Style
SOIC
No. Of Pins
14
Operating Temperature Range
-40°C To +125°C
Interface
EUSART
Termination Type
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP2022-330E/SL
Manufacturer:
Microchip
Quantity:
2 298
8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2009 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
Dimension Limits
A1
E
A
Units
EXPOSED
D2
A1
A3
E2
N
A
D
E
K
e
b
L
PAD
NOTE 2
K
0.80
0.00
0.00
0.00
0.25
0.30
0.20
MIN
MILLIMETERS
b
0.80 BSC
0.20 REF
4.00 BSC
4.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
2.20
3.00
0.30
0.55
8
–
Microchip Technology Drawing C04-131C
D2
2
MCP2021/2
e
1
MAX
1.00
0.05
2.80
3.60
0.35
0.65
N
–
DS22018E-page 29
E2
NOTE 1
L