25AA256-I/P Microchip Technology Inc., 25AA256-I/P Datasheet - Page 5

• Manufacturer Part Number: 25AA256-I/P
• Description: 256K, 32K X 8 , 1.8V SER EE IND
• Manufacturer: Microchip Technology Inc.

Specifications of 25AA256-I/P

• Capacitance, Input: 7 pF
• Capacitance, Output: 7 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 2.5 mA (Read), 0.6 mA (Write)
• Current, Output, Leakage: ±1
• Data Retention: >200 yrs.
• Density: 256K
• Interface: SPI Bus
• Memory Type: Serial EEPROM
• Organization: 32768×8
• Package Type: PDIP
• Temperature, Operating: -40 to +85 °C
• Time, Access: 50 ns
• Time, Address Hold: 250
• Time, Address Setup: 150
• Time, Fall: 100 ns
• Time, Rise: 100 ns
• Voltage, Esd: >4 kV
• Voltage, Input, High: 2.8 V
• Voltage, Input, Low: 0.36 V
• Voltage, Output, High: 1.3 V
• Voltage, Supply: 1.8 to 5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

25AA256/25LC256
DS21822F-page 16
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
–
–
eB
.100 BSC
E
INCHES
NOM
.310
.365
.130
.060
.018
.130
.250
.010
–
–
8
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–