PIC10F206-I/P Microchip Technology Inc., PIC10F206-I/P Datasheet - Page 81

• Manufacturer Part Number: PIC10F206-I/P
• Description: 8 PIN, 768 B FLASH, 24 RAM, 4 I/O
• Manufacturer: Microchip Technology Inc.

Specifications of PIC10F206-I/P

• Comparators: 1
• Cpu Speed: 1 MIPS
• Eeprom Memory: 0 Bytes
• Frequency: 4 MHz
• Input Output: 4
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 8-pin PDIP
• Programmable Memory: 750 Bytes
• Ram Size: 24 Bytes
• Speed: 4 MHz
• Timers: 1-8-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

8-Lead Dual Flat No-Leads (MC) - 2x3x0.9 (DFN)
© 2006 Microchip Technology Inc.
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
* Controlling Parameter
** Not within JEDEC parameters
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Length §
Contact-to-Exposed Pad
Contact Width
See ASME Y14.5M
See ASME Y14.5M
ID INDEX
(NOTE 1)
AREA
PIN 1
A3
Dimension Limits
TOP VIEW
D
§
Units
D2
E2
A3
A1
D
E
K
n
e
A
L
b
E
MIN
A1 A
Preliminary
.000
.059
.012
.008
.008
.031
.051
CONFIGURATION
ALTERNATE
DETAIL
CONTACT
.008 REF.
.020 BSC
.079 BSC
.118 BSC
INCHES
PIC10F200/202/204/206
NOM
EXPOSED
(NOTE 2)
.035
.016
.010
.001
METAL
EXPOSED
–
–
–
8
(NOTE 3)
K
PAD
TIE BAR
MAX
.039
.002
.069
.075
.020
.012
BOTTOM VIEW
b
–
MIN
1.30**
1.50**
D2
0.80
0.00
0.30
0.20
0.20
2
MILLIMETERS*
p
0.20 REF.
1
0.50 BSC
2.00 BSC
3.00 BSC
Revised 09-12-05
n
NOM
0.90
0.02
0.40
0.25
E2
–
–
–
8
L
MAX
1.00
0.05
1.75
1.90
0.50
0.30
DS41239C-page 79
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